LFE2M70E-5F900I

The LFE2M70E-5F900I is an ECP2M family field programmable gate array (FPGA) provided in a 900-ball BGA package. It delivers 67,000 logic elements, approximately 4.64 Mbits of on-chip RAM, and up to 416 general-purpose I/O pins for applications that require substantial programmable logic and memory integration.

Designed for industrial use, this device operates over a wide supply voltage range of 1.14 V to 1.26 V and an ambient temperature range of −40 °C to 100 °C, making it suitable for deployment in temperature-demanding environments.

Key Features

• Core Capacity — 67,000 logic elements provide a large fabric for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 4.64 Mbits of on-chip RAM to support buffer, FIFO, and intermediate storage requirements directly in the FPGA.
• High I/O Count — Up to 416 I/O pins to accommodate wide bus interfaces, multiple peripherals, and signal-rich systems.
• Package — 900-ball BGA packaging; supplier device package listed as 900-FPBGA (31 × 31 mm) for high-density board integration.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Industrial Temperature and Grade — Rated for industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and assembly.

Typical Applications

• Industrial Control — Use where robust operation across −40 °C to 100 °C and a high I/O count are required for sensor interfacing, motor control, and programmable logic tasks.
• Communications Interfaces — Suitable for implementing wide parallel or multi-channel serial interfaces that benefit from abundant I/O and on-chip RAM for buffering.
• Embedded Processing Acceleration — Deploy as custom acceleration logic or glue logic in systems that need substantial programmable resources and local memory.

Unique Advantages

• Large Logic Capacity: 67,000 logic elements enable complex digital designs without immediate partitioning across multiple devices.
• Generous On-Chip Memory: Approximately 4.64 Mbits of embedded RAM reduces external memory dependence and simplifies board design.
• Extensive I/O Availability: 416 I/O pins support integration with multiple peripherals and high-pin-count interfaces, lowering the need for external multiplexing.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• High-Density BGA Package: 900-ball BGA (900-FPBGA, 31 × 31 mm) allows compact, high-density PCB layouts for space-constrained systems.
• RoHS Compliance: Facilitates use in lead-free manufacturing flows and aligns with common environmental requirements.

Why Choose LFE2M70E-5F900I?

The LFE2M70E-5F900I positions itself as a high-capacity, industrial-grade FPGA option that balances sizable logic resources, embedded memory, and a high I/O count in a compact 900-ball BGA footprint. Its operating voltage and temperature specifications support integration into designs that must meet strict environmental and power constraints.

This device is well suited for engineers building systems that demand on-chip memory, substantial programmable logic, and flexible I/O routing while maintaining industrial temperature operation and RoHS compliance.

Request a quote or submit an inquiry to get pricing and availability for the LFE2M70E-5F900I. Our team can provide lead-time information and assist with technical details for your design requirements.