LFE2M70E-5FN900C

The LFE2M70E-5FN900C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-density programmable logic fabric with 67,000 logic elements and approximately 4.64 Mbits of embedded memory to support complex custom logic and system integration.

Designed for surface-mount applications, this commercial-grade FPGA provides up to 416 I/O pins in a 900-ball BGA package and operates from a core voltage range of 1.14 V to 1.26 V with an ambient temperature range of 0 °C to 85 °C. RoHS compliance is included.

Key Features

• Core Logic 67,000 logic elements provide substantial capacity for custom digital designs and moderate- to high-density logic implementations.
• Embedded Memory Approximately 4.64 Mbits of on-chip RAM to support buffering, state machines, and memory-mapped logic without external memory in many designs.
• I/O and Package Up to 416 I/O pins in a 900-ball BGA (900-BBGA / supplier package 900-FPBGA 31×31) enable broad external connectivity while saving board area with a compact BGA footprint.
• Power Core supply operating range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Temperature and Grade Commercial grade operation from 0 °C to 85 °C suitable for standard embedded and commercial electronic applications.
• Mounting & Compliance Surface mount device with RoHS compliance for lead-free assembly and global environmental requirements.

Typical Applications

• Custom Logic and Glue-Logic Use the FPGA to implement bespoke combinational and sequential logic that bridges and adapts between system components.
• High-Density I/O Control Leverage up to 416 I/O pins for multi-interface designs, parallel data paths, or wide bus implementations.
• On-Chip Memory-Dependent Functions Utilize approximately 4.64 Mbits of embedded RAM for packet buffering, FIFOs, or state storage without immediate reliance on external memory.

Unique Advantages

• Significant Logic Capacity: 67,000 logic elements enable complex programmable functions and allow consolidation of multiple discrete components into a single device.
• Substantial On-Chip Memory: Approximately 4.64 Mbits of embedded RAM supports buffering and local data storage, reducing external memory needs and simplifying board design.
• High I/O Count in a Compact Package: 416 I/O pins in a 900-ball BGA (31×31) provide broad connectivity while minimizing PCB footprint.
• Commercial-Grade Temperature Range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Meets lead-free environmental requirements for modern electronics assembly.
• Surface-Mount Convenience: Designed for standard surface-mount manufacturing processes to integrate into automated production flows.

Why Choose LFE2M70E-5FN900C?

The LFE2M70E-5FN900C provides a balanced combination of logic capacity, embedded memory, and I/O density in a commercial-grade, surface-mount BGA package. Its specification set is appropriate for designs that need significant on-chip resources and flexible connectivity while maintaining compact board area and standard assembly practices.

This FPGA is suited to engineering teams and procurement looking for a mid-to-high density programmable device that integrates memory and I/O in a single component, simplifying BOM and enabling scalable designs with long-term support from the manufacturer.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for the LFE2M70E-5FN900C. Our team can provide technical and procurement assistance to help integrate this FPGA into your design.