LFE2M70E-6FN1152C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 436 4642816 67000 1152-BBGA |
|---|---|
| Quantity | 53 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 436 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8375 | Number of Logic Elements/Cells | 67000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4642816 |
Overview of LFE2M70E-6FN1152C – ECP2M Field Programmable Gate Array (FPGA) IC 436 4642816 67000 1152-BBGA
The LFE2M70E-6FN1152C is a field programmable gate array (FPGA) from Lattice Semiconductor designed for reconfigurable logic implementations. It delivers a balance of on-chip memory, logic capacity, and high I/O density in a compact surface-mount ball-grid array package.
Key architectural highlights include approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory, and support for up to 436 I/O pins, making it suited for designs that require substantial programmable logic and I/O integration within a commercial temperature range.
Key Features
- Core Logic Approximately 67,000 logic elements provide substantial programmable logic capacity for custom digital functions.
- Embedded Memory Approximately 4.64 Mbits of on-chip RAM (4,642,816 bits) to support buffering, state storage, and custom memory structures.
- I/O Density Up to 436 I/O pins to enable broad external interfacing and connectivity options in a single device.
- Package & Mounting 1152-BBGA package; supplier device package listed as 1152-FPBGA (35×35) with surface-mount mounting for compact board integration.
- Power Requirements Nominal supply range of 1.14 V to 1.26 V for core operation.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- High Logic Capacity: Approximately 67,000 logic elements enable implementation of complex custom logic functions without external ASICs.
- Substantial On-Chip Memory: About 4.64 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
- Extensive I/O Count: Up to 436 I/O pins simplify board-level routing and support dense peripheral interfacing.
- Compact Surface-Mount Package: 1152-FPBGA (35×35) BGA delivers high integration density for space-constrained PCBs.
- Low-Voltage Core: 1.14 V–1.26 V supply range supports lower-power core operation compared to higher-voltage alternatives.
- Commercial Temperature Qualification: Rated 0 °C–85 °C for designs intended for standard commercial environments.
Why Choose LFE2M70E-6FN1152C?
The LFE2M70E-6FN1152C positions itself as a high-capacity FPGA option from Lattice Semiconductor, offering a combination of substantial logic elements, significant on-chip RAM, and a large I/O complement in a single surface-mount BGA package. These characteristics make it a practical choice for designers needing integrated programmable logic and memory in commercial-temperature applications.
With RoHS compliance and published technical documentation from the manufacturer, this device suits teams seeking a scalable, well-documented FPGA solution that consolidates logic, memory, and I/O to simplify board-level design and reduce external component count.
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