LFE2M70E-6FN1152C

IC FPGA 436 I/O 1152FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 436 4642816 67000 1152-BBGA

Quantity 53 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O436Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8375Number of Logic Elements/Cells67000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4642816

Overview of LFE2M70E-6FN1152C – ECP2M Field Programmable Gate Array (FPGA) IC 436 4642816 67000 1152-BBGA

The LFE2M70E-6FN1152C is a field programmable gate array (FPGA) from Lattice Semiconductor designed for reconfigurable logic implementations. It delivers a balance of on-chip memory, logic capacity, and high I/O density in a compact surface-mount ball-grid array package.

Key architectural highlights include approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory, and support for up to 436 I/O pins, making it suited for designs that require substantial programmable logic and I/O integration within a commercial temperature range.

Key Features

  • Core Logic  Approximately 67,000 logic elements provide substantial programmable logic capacity for custom digital functions.
  • Embedded Memory  Approximately 4.64 Mbits of on-chip RAM (4,642,816 bits) to support buffering, state storage, and custom memory structures.
  • I/O Density  Up to 436 I/O pins to enable broad external interfacing and connectivity options in a single device.
  • Package & Mounting  1152-BBGA package; supplier device package listed as 1152-FPBGA (35×35) with surface-mount mounting for compact board integration.
  • Power Requirements  Nominal supply range of 1.14 V to 1.26 V for core operation.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
  • Regulatory Compliance  RoHS compliant.

Unique Advantages

  • High Logic Capacity: Approximately 67,000 logic elements enable implementation of complex custom logic functions without external ASICs.
  • Substantial On-Chip Memory: About 4.64 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
  • Extensive I/O Count: Up to 436 I/O pins simplify board-level routing and support dense peripheral interfacing.
  • Compact Surface-Mount Package: 1152-FPBGA (35×35) BGA delivers high integration density for space-constrained PCBs.
  • Low-Voltage Core: 1.14 V–1.26 V supply range supports lower-power core operation compared to higher-voltage alternatives.
  • Commercial Temperature Qualification: Rated 0 °C–85 °C for designs intended for standard commercial environments.

Why Choose LFE2M70E-6FN1152C?

The LFE2M70E-6FN1152C positions itself as a high-capacity FPGA option from Lattice Semiconductor, offering a combination of substantial logic elements, significant on-chip RAM, and a large I/O complement in a single surface-mount BGA package. These characteristics make it a practical choice for designers needing integrated programmable logic and memory in commercial-temperature applications.

With RoHS compliance and published technical documentation from the manufacturer, this device suits teams seeking a scalable, well-documented FPGA solution that consolidates logic, memory, and I/O to simplify board-level design and reduce external component count.

Request a quote or submit an inquiry to receive pricing and availability information for LFE2M70E-6FN1152C.

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