LFE2M70E-7F900C

The LFE2M70E-7F900C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor, supplied in a 900-ball BGA package. It provides a high-density programmable fabric with approximately 67,000 logic elements and about 4.64 Mbits of embedded memory, suitable for designs that require substantial on-chip logic and memory resources.

With 416 general-purpose I/O and a narrow core supply range of 1.14 V to 1.26 V, this surface-mount device targets systems that need dense I/O, significant logic capacity, and controlled power-domain design within a standard commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Approximately 67,000 logic elements (cells) provide on-chip programmable logic resources for complex combinational and sequential functions.
• Embedded Memory Approximately 4.64 Mbits of total RAM bits for on-chip data storage, buffering, and state retention.
• I/O Density 416 available I/O pins to support multiple parallel interfaces, bus implementations, and connectivity requirements.
• Package & Mounting 900-ball fine-pitch BGA in a 900-FPBGA (31×31) footprint, designed for surface-mount assembly to save PCB area while supporting high pin count routing.
• Power Core voltage supply range of 1.14 V to 1.26 V for designs that require a defined low-voltage core domain.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and environmental requirements.
• Logic Structure 8,375 CLB-like logic blocks (as provided) to organize logic resource allocation and design partitioning.

Typical Applications

• High-density I/O systems — Leverage 416 I/O pins and abundant logic elements to implement protocol bridging, parallel interfaces, and multi-channel I/O aggregation.
• Embedded processing and acceleration — Use the approximately 67,000 logic elements and ~4.64 Mbits of on-chip RAM for custom data-path acceleration, buffering, and control logic.
• Communications and protocol handling — Implement multi-protocol translators and packet processing functions that benefit from high I/O count and embedded memory resources.

Unique Advantages

• High logic capacity: Approximately 67,000 logic elements enable complex custom logic and system integration on a single device, reducing external component count.
• Significant on-chip memory: Approximately 4.64 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage, simplifying board design.
• Large I/O availability: 416 I/O pins support dense interface requirements and flexible partitioning of system functions across many signals.
• Compact high-pin-count package: 900-ball FPBGA (31×31) provides a small PCB footprint for a device with substantial routing and connectivity capability.
• Commercial-grade, RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS, suitable for mainstream electronic products and assemblies.

Why Choose LFE2M70E-7F900C?

The LFE2M70E-7F900C balances high-density programmable logic, substantial embedded memory resources, and a large I/O complement in a compact 900-ball BGA package. Its defined core voltage range and commercial operating temperature make it appropriate for designs that require deterministic power domains and standard ambient operating conditions.

This device is well suited to engineers building systems that consolidate multiple functions into a single FPGA—reducing bill-of-materials and simplifying board-level integration—while relying on Lattice Semiconductor's product lineage and documentation for design support and scalability across similar device families.

Request a quote or contact our sales team to discuss availability, pricing, and how the LFE2M70E-7F900C can fit into your next design.