LFE2M70E-6FN1152I

The LFE2M70E-6FN1152I is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-density programmable logic fabric with 67,000 logic elements, integrated on-chip RAM, and a large I/O complement for applications that require significant logic capacity and connectivity.

This device is supplied in a 1152-ball BGA package and is specified for industrial operation, with a wide operating temperature range and a low-voltage core supply requirement, making it suitable for industrial-grade embedded designs that demand compact, high-density programmable logic.

Key Features

• Core Logic Density  Provides 67,000 logic elements and 8,375 CLBs for implementing complex programmable logic and custom digital functions.
• On‑Chip Memory  Approximately 4.64 Mbits of embedded memory (4,642,816 bits) to support buffering, state storage, and local data processing.
• High I/O Count  436 user I/Os to support dense connectivity with external devices, sensors, and peripherals.
• Power  Core supply voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system designs.
• Package  1152-BBGA (supplier package: 1152-FPBGA 35×35) offering a compact, high-ball-count footprint for board-level integration.
• Industrial Temperature Rating  Specified operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Mounting  Surface-mount device (SMD) suitable for standard PCB assembly processes.

Typical Applications

• Industrial Control and Automation  Programmable logic and robust temperature rating support control systems and automation equipment operating across industrial temperature ranges.
• High‑Density I/O Systems  Large number of I/Os enables designs that require extensive peripheral interfacing or multi-channel signal routing.
• Embedded Processing and Data Handling  Significant logic element count and on-chip memory allow implementation of custom data paths, buffering, and protocol handling within compact systems.

Unique Advantages

• High Logic Capacity: 67,000 logic elements allow implementation of complex algorithms and extensive custom logic on a single device.
• Substantial Embedded Memory: Approximately 4.64 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 436 user I/Os provide flexibility for dense interconnect and multi-interface designs, minimizing external multiplexing.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Low-Voltage Core: 1.14 V–1.26 V supply helps align with modern low-voltage system power domains.
• Compact High‑Ball‑Count Package: 1152-BBGA (1152-FPBGA, 35×35) enables a high-density implementation while conserving PCB area.

Why Choose LFE2M70E-6FN1152I?

The LFE2M70E-6FN1152I combines a high logic element count, considerable embedded memory, and a large I/O complement in a compact BGA package, positioned for industrial-grade embedded designs that need substantial programmable logic capacity. Its low-voltage core and wide operating temperature range make it suitable for applications requiring both density and environmental robustness.

This FPGA is well suited to engineers and designers building systems that require high integration of logic and memory with extensive external connectivity, while maintaining industrial temperature capability and RoHS compliance.

Request a quote or contact sales to discuss availability, pricing, and how the LFE2M70E-6FN1152I can fit your design requirements.