LFE2M70E-6FN900C

The LFE2M70E-6FN900C is a Field Programmable Gate Array (FPGA) device from Lattice Semiconductor provided in a 900-ball BGA package. It integrates 67,000 logic elements, approximately 4.64 Mbits of embedded memory, and 416 user I/O pins to address designs that require significant programmable logic, on-chip memory, and broad I/O connectivity.

Supplied as a commercial-grade, surface-mount device, this FPGA operates from a 1.14 V to 1.26 V core voltage range and is RoHS compliant, making it suitable for volume electronic designs that prioritize integration and board-level density.

Key Features

• Core Logic  67,000 logic elements provide the programmable compute fabric required for complex digital functions and custom IP implementation.
• Embedded Memory  Approximately 4.64 Mbits of on-chip RAM supports framebuffer, buffering, and other data-storage needs without external memory in many use cases.
• High I/O Count  416 user I/O pins enable extensive interfacing to peripherals, sensors, and other system components for multi-channel or multi-protocol designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V allows designers to plan power delivery and sequencing precisely for system integration.
• Package & Mounting  900-ball FPBGA (31 × 31 mm) package suited for surface-mount assembly to maximize board density and thermal distribution.
• Operating Conditions  Commercial operating temperature range of 0 °C to 85 °C, matching typical commercial electronics environment requirements.
• Regulatory  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• High-density I/O systems  Used where many external interfaces are required; the 416 I/O lines enable complex connectivity without additional multiplexing hardware.
• Embedded memory-centric designs  On-chip RAM (≈4.64 Mbits) supports buffering and data handling for applications that benefit from internal memory resources.
• Custom digital logic and acceleration  The 67,000 logic elements are suited to implement custom processing blocks, protocol engines, and glue logic for specialized functions.

Unique Advantages

• High integration density: Combines large logic capacity and substantial embedded memory in a single-package FPGA to reduce external components and simplify board design.
• Extensive I/O availability: 416 I/O pins support rich peripheral and system interconnectivity, lowering the need for external I/O expanders.
• Compact ball-grid packaging: 900-FPBGA (31 × 31 mm) provides a compact footprint for high-density PCB layouts while supporting surface-mount assembly.
• Predictable power envelope: Narrow core voltage range (1.14 V–1.26 V) helps streamline power-supply design and sequencing in the system.
• Commercial-grade readiness: Specified operating range of 0 °C–85 °C and RoHS compliance align the device with standard commercial product requirements.

Why Choose LFE2M70E-6FN900C?

The LFE2M70E-6FN900C delivers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 900-ball BGA package, making it a strong option for designs that require substantial programmable resources and board-level density. Its commercial-grade temperature range and RoHS compliance support mainstream electronic product development and manufacturing.

This FPGA is suited to engineering teams building systems that need on-chip memory, extensive interfacing, and significant programmable logic without increasing PCB footprint or BOM complexity. The device’s specification set supports scalable design choices and predictable integration into volume production environments.

Request a quote or submit your requirements to receive pricing and availability for the LFE2M70E-6FN900C. Our team can assist with lead times and volume purchasing information.