LFE2M70E-7FN900C

The LFE2M70E-7FN900C is a field programmable gate array (FPGA) from Lattice Semiconductor’s ECP2M family, providing a high-density programmable logic fabric with on-chip memory and extensive I/O. It is built for designs that require substantial logic capacity, abundant embedded RAM, and a large I/O count in a compact BGA package.

This commercial-grade device operates from 1.14 V to 1.26 V and supports an ambient operating range of 0 °C to 85 °C, suitable for a wide range of standard embedded applications.

Key Features

• Logic Capacity — 67,000 logic elements and 8,375 logic blocks provide substantial programmable resources for complex digital designs.
• Embedded Memory — Approximately 4.64 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• I/O Resources — Up to 416 I/O pins to enable extensive peripheral interfacing and custom I/O configurations.
• Package — 900-ball BGA (900-FPBGA, 31 × 31 mm) for high pin count in a compact surface-mount form factor.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V for compatibility with modern low-voltage systems.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance — Surface-mount package and RoHS compliance for standard manufacturing and environmental requirements.

Typical Applications

• Embedded systems — Implement custom logic, control functions, and local data handling using the device’s large logic and memory resources.
• High-density I/O bridging — Aggregate and route signals between peripherals and system components leveraging up to 416 I/Os.
• Signal buffering and packet processing — Use the substantial on-chip RAM for temporary storage and fast data-path processing inside communication or processing blocks.
• Prototyping and system integration — Deploy as a programmable platform to validate complex logic functions and integrate multiple interfaces into a single component.

Unique Advantages

• High logic density: 67,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Significant embedded memory: Approximately 4.64 Mbits of on-chip RAM reduces the need for external memory in many buffering and processing tasks.
• Extensive I/O capability: 416 I/Os support broad peripheral connectivity and flexible interface mapping.
• Compact, high-pin-count package: The 900-ball BGA (31 × 31 mm) delivers high connectivity in a space-efficient surface-mount footprint.
• Low-voltage core operation: 1.14 V to 1.26 V supply requirements align with contemporary low-voltage system architectures.
• RoHS compliant: Environmentally compliant manufacturing and assembly with surface-mount mounting type.

Why Choose LFE2M70E-7FN900C?

The LFE2M70E-7FN900C positions itself as a high-capacity, commercially graded FPGA option for designers who need a combination of large logic resources, substantial embedded RAM, and a high I/O count in a compact BGA package. Its low-voltage operation and RoHS compliance make it suitable for modern embedded platforms that prioritize integration and manufacturability.

This device is well suited for development teams and product engineers aiming to consolidate functions, reduce BOM complexity, and accelerate implementation of custom digital logic. As part of the Lattice ECP2M family, it offers a defined balance of logic, memory, and I/O for scalable designs.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for LFE2M70E-7FN900C. Our team will respond with the details you need to move your design forward.