LFE2M70SE-5FN1152C

The LFE2M70SE-5FN1152C is a commercial-grade ECP2M family Field Programmable Gate Array (FPGA) in a 1152-BBGA package. It delivers a high-density programmable logic fabric with 67,000 logic elements, substantial embedded memory, and a large I/O count for compact, high-functionality designs.

Designed for commercial embedded applications, this device combines low-voltage operation with a compact surface-mount package to support systems that require configurable logic, significant on-chip RAM, and extensive external connectivity within a controlled operating-temperature range.

Key Features

• Core Logic  67,000 logic elements provide programmable resources for custom logic implementation and hardware acceleration tasks.
• Embedded Memory  Approximately 4.64 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage without external memory.
• I/O Capacity  436 I/O pins enable broad interfacing options for parallel buses, high-pin-count connectors, and multi-channel peripherals.
• Power  Operates from a low-voltage supply range of 1.14 V to 1.26 V to match modern system power domains and help optimize power budgets.
• Package & Mounting  1152-BBGA (supplier device package: 1152-FPBGA, 35 × 35 mm) in a surface-mount form factor for space-constrained board designs.
• Operating Range  Rated for commercial temperature operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use as a configurable logic engine for control, protocol adaptation, and custom processing in consumer and enterprise equipment within commercial temperature ranges.
• High‑Density I/O Interfaces  Ideal for designs that require many external connections—such as multiport bridging, complex sensor arrays, or multi-channel I/O aggregation—leveraging the 436 available I/Os.
• Memory‑Assisted Processing  Embedded memory supports on-chip buffering and packet or data staging to reduce dependency on external RAM in bandwidth-sensitive applications.

Unique Advantages

• High logic capacity: 67,000 logic elements allow implementation of complex state machines, parallel datapaths, and hardware accelerators without adding discrete ASICs.
• Substantial on‑chip RAM: Approximately 4.64 Mbits of embedded memory reduces board-level BOM and simplifies timing for intermediate data storage.
• Extensive I/O connectivity: 436 I/Os enable direct interfacing to multiple peripherals and high-pin-count systems, minimizing external multiplexing logic.
• Compact, manufacturable package: 1152-BBGA surface-mount package (35 × 35 mm footprint) balances density and board placement flexibility for modern PCBs.
• Low-voltage operation: 1.14 V to 1.26 V supply range aligns with contemporary power architectures to help manage system-level power consumption.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for reliable performance in commercial product environments.

Why Choose LFE2M70SE-5FN1152C?

The LFE2M70SE-5FN1152C positions itself as a high-capacity, commercially rated FPGA option for designs that require a balance of logic density, on-chip memory, and large I/O capability in a compact BGA package. Its low-voltage operation and RoHS compliance make it suitable for modern commercial platforms where board space and power management are important design drivers.

This device is well suited to engineers and OEMs building scalable, configurable systems—particularly where integration of significant logic and memory on-chip can reduce BOM, simplify board design, and accelerate time-to-market.

Request a quote or submit an inquiry to receive pricing and availability for LFE2M70SE-5FN1152C and to discuss how this FPGA can fit into your next commercial embedded design.