LFE2M70SE-6F900C

The LFE2M70SE-6F900C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It delivers a high-density programmable fabric suited to designs that require substantial logic capacity, on-chip memory and large I/O counts in a compact surface-mount package.

Key device-level attributes include approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory, 416 user I/O pins and a 900-ball BGA package. The device operates from a 1.14 V to 1.26 V core supply and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant and supplied in a 900-FPBGA (31×31) package footprint.

Key Features

• Core Logic Density Approximately 67,000 logic elements provide scalable programmable resources for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 4.64 Mbits of on-chip RAM available for buffering, FIFOs and state storage to support data-path and control applications.
• I/O Capacity 416 user I/O pins to support wide parallel interfaces, multiple serial lanes or mixed-signal interfacing at the board level.
• Power Core supply voltage range of 1.14 V to 1.26 V for the programmable fabric.
• Package & Mounting Supplied in a 900-ball BGA (900-FPBGA, 31×31) package for surface-mount assembly and compact board-level integration.
• Operating Conditions Commercial grade operation specified from 0 °C to 85 °C for typical embedded and consumer applications.
• Regulatory RoHS compliant.

Unique Advantages

• High logic capacity: Large programmable resource pool (≈67,000 logic elements) enables implementation of complex algorithms and multiple concurrent functions on a single device.
• Substantial on-chip memory: Approximately 4.64 Mbits of embedded RAM reduces external memory dependence and simplifies board-level BOM and routing.
• Extensive I/O count: 416 I/O pins support broad interfacing options for parallel buses, sensor networks and multi-channel connectivity.
• Compact BGA package: 900-ball FPBGA (31×31) footprint allows dense PCB routing while keeping the assembly profile small.
• Low-voltage core: Narrow core supply range (1.14 V–1.26 V) aligns with modern low-voltage system designs.
• Commercial-grade readiness: Specified operation from 0 °C to 85 °C for mainstream embedded and consumer applications.

Why Choose LFE2M70SE-6F900C?

The LFE2M70SE-6F900C positions itself as a high-density ECP2M FPGA option for designers who need substantial programmable logic, significant embedded memory and a large number of I/O in a compact surface-mount package. Its combination of logic elements, on-chip RAM and I/O count makes it suitable for consolidated digital functions where board-level integration and BOM reduction matter.

Backed by Lattice Semiconductor manufacturing, this RoHS-compliant commercial-grade FPGA is appropriate for development teams and OEMs targeting high-functionality embedded designs that require on-chip resources and a compact BGA footprint. The device’s specification set supports scalability within designs that emphasize integration and board-area efficiency.

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