LFE2M70SE-5FN900I

The LFE2M70SE-5FN900I is an industrial-grade field programmable gate array (FPGA) supplied in a 900-ball BGA package. It provides a high-density programmable fabric with 67,000 logic elements, approximately 4.64 Mbits of on-chip RAM, and 416 general-purpose I/O pins for designs that require significant logic capacity and extensive external interfacing.

Engineered for surface-mount PCB integration, the device operates from a core voltage range of 1.14 V to 1.26 V and supports an operating temperature range of −40 °C to 100 °C, making it suitable for demanding industrial and embedded environments where thermal and environmental robustness are required.

Key Features

• Core Capacity — 67,000 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.64 Mbits of on-chip RAM to support data buffering, state machines, and memory-intensive logic without immediate reliance on external memory.
• I/O Density — 416 general-purpose I/O pins to accommodate wide parallel interfaces, multiple peripherals, and extensive external connectivity.
• Package and Mounting — Available in a 900-ball BGA (900-BBGA) / 900-FPBGA (31×31) package; surface-mount mounting type simplifies integration into compact board designs.
• Power — Core supply voltage range of 1.14 V to 1.26 V for the programmable fabric.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in outdoor, factory, and industrial control environments.
• Compliance — RoHS compliant to meet standard environmental requirements.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, protocol bridging, and I/O aggregation in industrial systems that require wide operating temperature tolerance.
• I/O-Intensive Embedded Systems — Support designs that need many external sensors, actuators, or parallel interfaces using the 416 available I/O pins.
• Memory-Dependent Processing — Use the on-chip RAM for local buffering, lookup tables, and stateful processing in embedded data paths.

Unique Advantages

• High logic capacity: 67,000 logic elements enable implementation of large, complex designs without immediate external programmable logic.
• Substantial on-chip memory: Approximately 4.64 Mbits of embedded RAM reduces dependency on external memory for many applications, simplifying board-level design.
• Extensive external connectivity: 416 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high-pin-count buses.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in challenging thermal environments common in industrial applications.
• Compact BGA package: 900-ball BGA / 900-FPBGA (31×31) provides a dense form factor for space-constrained systems while enabling high pin count.
• RoHS compliant: Meets common environmental compliance requirements for commercial and industrial production.

Why Choose LFE2M70SE-5FN900I?

The LFE2M70SE-5FN900I delivers a balance of high logic density, significant embedded memory, and broad I/O capability in a compact BGA package rated for industrial temperatures. It is well suited for engineers designing complex programmable logic functions in industrial and embedded systems where on-chip resources and reliable operation across a wide temperature range are priorities.

Its combination of 67,000 logic elements, approximately 4.64 Mbits of RAM, and 416 I/O pins offers designers the capacity to consolidate functions, reduce external components, and scale functionality while maintaining a small board footprint and adherence to RoHS requirements.

Request a quote or submit an inquiry to get pricing and availability for LFE2M70SE-5FN900I and to discuss how this FPGA can fit your design requirements.