LFE2M70SE-5FN900C

The LFE2M70SE-5FN900C is an ECP2M-family FPGA from Lattice Semiconductor, supplied in a 900-ball BGA (31 × 31 mm) surface-mount package. It provides a high-density programmable fabric with approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory, and 416 user I/Os, delivering a balanced combination of logic capacity, on-chip RAM, and I/O bandwidth for commercial embedded and communications designs.

As part of the LatticeECP2/M family, this device leverages the family architecture for performance-oriented tasks such as signal processing and high-speed serial connectivity, while maintaining a compact package and commercial-grade operating range for mainstream applications.

Key Features

• Logic Capacity — Approximately 67,000 logic elements suitable for complex, densely routed designs and high-level integration.
• Embedded Memory — Approximately 4.64 Mbits (4,642,816 bits) of on-chip RAM to support frame buffers, packet queues, and intermediate data storage without external SRAM.
• I/O Density — 416 user I/Os provided in a 900-ball BGA package to support broad peripheral and bus interfacing requirements.
• Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting in system designs.
• Package & Mounting — 900-ball FBGA (900-BBGA / 900-FPBGA, 31 × 31 mm), surface-mount for compact board-level integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
• Family-Level Capabilities (LatticeECP2/M) — The ECP2/M family includes advanced features such as embedded SERDES (250 Mbps to 3.125 Gbps), sysDSP blocks for multiply/accumulate operations, flexible embedded block RAM configurations, and multiple PLL/DLL clock resources—useful for designs that require high-speed serial links, DSP acceleration, and flexible clocking.

Typical Applications

• High‑performance communications — Implement packet processing, protocol bridging, and high-speed serial links using the device’s I/O density and the ECP2/M family’s SERDES capabilities.
• Signal processing — Leverage the device’s logic and embedded memory to perform real-time DSP tasks, buffering, and data manipulation in commercial signal-processing equipment.
• Embedded control and integration — Consolidate multiple peripheral interfaces and control logic into a single FPGA for compact embedded systems and industrial controllers within commercial temperature ranges.
• Data acquisition and instrumentation — Use on-chip RAM and abundant I/Os to implement front-end buffering, preprocessing, and timing-critical interfaces in test and measurement gear.

Unique Advantages

• High integration in a compact package — 67,000 logic elements and 416 I/Os in a 900-ball BGA reduce board-level component count and simplify system integration.
• Substantial on-chip memory — Approximately 4.64 Mbits of embedded RAM lowers dependence on external memory for many buffering and buffering-intensive tasks.
• Commercial-ready thermal profile — 0 °C to 85 °C operating range aligns with mainstream commercial deployments without over-specifying for industrial or automotive environments.
• Predictable power domain — Narrow core supply window (1.14–1.26 V) simplifies power-supply design and thermal budgeting.
• Family ecosystem — Benefits from ECP2/M family architecture including DSP blocks, configurable PLLs/DLLs, and high-speed serial options for scalable design reuse.

Why Choose LFE2M70SE-5FN900C?

LFE2M70SE-5FN900C brings together a high logic count, sizeable embedded memory, and a large complement of I/Os in a single 900-ball BGA package—making it a strong choice for commercial applications that demand consolidated functionality and board-area efficiency. Its compatibility with the LatticeECP2/M family architecture provides access to family-level capabilities such as embedded SERDES, DSP resources, and flexible memory options for designs that require both logic density and high-speed interfacing.

This device is well suited for engineers building communications equipment, embedded controllers, and data-processing modules who need a commercially graded, RoHS-compliant FPGA with predictable power and thermal characteristics and an ecosystem of family-level features for scalable development.

Request a quote or submit an inquiry for LFE2M70SE-5FN900C to receive pricing and availability information tailored to your project requirements.