LFE2M70SE-5FN1152I

The LFE2M70SE-5FN1152I is a Field Programmable Gate Array (FPGA) device from Lattice Semiconductor designed for industrial applications. It combines a large logic fabric, substantial on-chip memory, and a high I/O count in a 1152-BBGA surface-mount package, supporting system designs that require dense programmable logic and extended temperature operation.

Key value propositions are its approximately 67,000 logic elements, roughly 4.64 Mbits of embedded memory, and up to 436 I/Os, delivered within a compact 1152-pin BGA footprint and an industrial temperature rating.

Key Features

• Logic Capacity — Approximately 67,000 logic elements for implementing complex programmable logic and system functions.
• Embedded Memory — Total on-chip memory of 4,642,816 bits (approximately 4.64 Mbits) to support buffering, lookup tables, and state storage.
• I/O Density — Up to 436 I/Os to interface with sensors, peripherals, and external devices in high-pin-count applications.
• Power — Nominal core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package and Mounting — 1152-BBGA package (supplier device package: 1152-FPBGA, 35×35) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C, suitable for temperature-demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic and I/O aggregation using the device’s high I/O count and large logic capacity within industrial temperature environments.
• Data Buffering and Processing — Use the approximately 4.64 Mbits of embedded memory for on-chip buffering, FIFO, and temporary data storage in embedded systems.
• Interface Bridging — Leverage up to 436 I/Os to bridge multiple peripherals and subsystems on compact PCBs.

Unique Advantages

• High Logic Density: Approximately 67,000 logic elements enable implementation of sizable custom logic functions without external programmable devices.
• Substantial On-Chip Memory: Approximately 4.64 Mbits of embedded memory reduces reliance on external RAM for many buffering and state-storage needs.
• Large I/O Count: 436 I/Os simplify connectivity to sensors, actuators, and peripherals, minimizing board-level multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact BGA Footprint: 1152-pin BGA (35×35) enables a high-pin-count solution in a space-efficient, surface-mount package.
• RoHS Compliant: Meets RoHS requirements for lead-free assembly and regulatory compliance in targeted markets.

Why Choose LFE2M70SE-5FN1152I?

The LFE2M70SE-5FN1152I positions itself as a robust, industrial-grade FPGA option that balances logic capacity, embedded memory, and I/O density in a single compact package. Its voltage and temperature specifications make it appropriate for designers building systems that require reliable, programmable logic in temperature-challenged environments.

Engineering teams seeking scalability in logic and memory, along with high I/O integration on a 1152-BBGA footprint, will find this device suited to reducing external component count and simplifying PCB routing while maintaining RoHS compliance.

Request a quote or submit a parts request to obtain pricing and availability for the LFE2M70SE-5FN1152I.