LFE2M70SE-6F900I

The LFE2M70SE-6F900I is an industrial-grade Lattice ECP2M family FPGA in a 900-ball BGA package optimized for mid-to-high density system designs. It provides 67,000 logic elements, approximately 4.64 Mbits of embedded memory, and 416 user I/Os in a 31 × 31 mm 900-FPBGA footprint for complex control, connectivity and signal processing tasks. With a specified supply range of 1.14 V to 1.26 V and an operating temperature of -40 °C to 100 °C, this device targets robust industrial applications that require scalable logic, on-chip memory and flexible I/O integration.

Key Features

• Logic Capacity — 67,000 logic elements suitable for medium-to-large designs requiring substantial programmable logic resources.
• Embedded Memory — Approximately 4.64 Mbits of on-chip RAM to support buffering, packet processing and algorithm state storage.
• I/O Density & Flexibility — 416 I/Os available for interfacing to peripherals, sensors and high-pin-count systems; multiple I/O standards supported across the ECP2/M family.
• High-Speed Serial Options (family) — Lattice ECP2M devices include embedded SERDES supporting protocols such as PCI Express and Gigabit Ethernet (family-level feature).
• DSP & Memory Architecture (family) — Advanced sysDSP blocks and flexible embedded block RAM configurations are available across the ECP2/M family for multiply-accumulate and high-performance data paths.
• Clocking Resources (family) — Analog PLLs and DLLs (GPLLs, SPLLs and DLLs) for clock multiplication, division and phase adjustment as provided by the ECP2/M architecture.
• Package & Mounting — 900-ball FPBGA (31 × 31 mm) package, surface-mount mounting type; package case listed as 900-BBGA / supplier device package 900-FPBGA.
• Industrial Temperature & Power — Rated for -40 °C to 100 °C operation and a core supply window of 1.14 V to 1.26 V for stable operation in industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Networking and Communications — Implement protocol offload and bridging for Ethernet, PCIe, or specialized serial links using the family’s high-speed serial and programmable I/O capabilities.
• Signal Processing & DSP — Leverage embedded memory and sysDSP-family blocks for filtering, FFTs and real-time processing pipelines.
• Data Aggregation & Packet Processing — Use the large logic and RAM resources to implement packet buffering, parsing and custom routing in networked systems and appliances.
• High-Density Control Systems — Integrate multiple sensor interfaces, motor-control logic and supervisory functions within a single FPGA to reduce BOM count and board complexity.

Unique Advantages

• Substantial On-Chip Resources: 67,000 logic elements and ~4.64 Mbits of embedded RAM enable complex functions on-chip without external memory dependence.
• High I/O Count: 416 I/Os provide extensive external connectivity for multi-interface systems and dense peripheral integration.
• Industrial Temperature Range: Specified operation from -40 °C to 100 °C for deployment in demanding thermal environments.
• Compact High-Ball-Count Package: 900-ball FPBGA (31 × 31 mm) offers a high pin-count solution in a compact BGA footprint for space-constrained designs.
• Family-Level High-Speed Features: Access to ECP2M family capabilities such as embedded SERDES, advanced DSP blocks and flexible clocking resources to accelerate development of communication and signal-processing designs.
• RoHS Compliant: Meets standard environmental compliance requirements for modern electronic assemblies.

Why Choose LFE2M70SE-6F900I?

The LFE2M70SE-6F900I combines sizable programmable logic, multi-megabit embedded memory and a high I/O count in a robust industrial-grade package, making it well suited for mid- to high-complexity designs that require integration of control, communication and signal processing functions. Its ECP2M family heritage brings advanced DSP structures, flexible memory architectures and high-speed serial capability at the system level, offering design scalability and reduced external component count.

This device is ideal for engineers and teams building industrial networking equipment, data aggregation appliances, and embedded systems that demand reliable operation across a wide temperature range and consolidated on-chip resources backed by the ECP2/M architecture.

Request a quote or submit an inquiry today to obtain pricing and availability for the LFE2M70SE-6F900I and evaluate how it fits your next design.