LFE2M70SE-6FN900C

The LFE2M70SE-6FN900C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, provided in a 900-ball BGA package. It combines a high logic element count with substantial on-chip memory and a large I/O complement, addressing designs that require programmable logic density and broad interfacing capability.

Built for commercial-grade applications, this surface-mount FPGA supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, making it suitable for a variety of board-level embedded designs.

Key Features

• Core Logic 67,000 logic elements and 8,375 CLBs provide substantial programmable logic capacity for mid-to-high complexity designs.
• Embedded Memory Approximately 4.64 Mbits of on-chip RAM to store buffers, state machines, and small data structures without external memory.
• I/O Capability 416 dedicated I/O pins to support extensive peripheral, sensor, and bus interfacing directly from the FPGA.
• Package & Mounting 900-BBGA package (supplier device package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact, board-level integration.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power rails and reference designs that use similar core domains.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• I/O Expansion and Protocol Bridging — Use the 416 I/O pins and configurable logic to implement bus bridges, protocol converters, and multi-interface glue logic.
• Embedded System Control — Leverage the 67,000 logic elements and on-chip RAM for custom control logic, state machines, and timing-critical system functions.
• High-Density Interface Aggregation — Aggregate and manage many peripheral interfaces or sensor inputs for board-level subsystems that require dense I/O and flexible datapath routing.

Unique Advantages

• High Logic Capacity: 67,000 logic elements enable complex combinational and sequential logic implementations without immediate need for external co-processors.
• Significant On-Chip Memory: Approximately 4.64 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Extensive I/O Count: 416 I/O pins provide flexibility to interface directly with a wide range of peripherals and connectors, simplifying board design.
• Compact BGA Footprint: 900-BBGA (900-FPBGA, 31 × 31 mm) delivers a high-pin-count solution in a compact surface-mount package for space-constrained PCBs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LFE2M70SE-6FN900C?

The LFE2M70SE-6FN900C positions itself as a versatile, mid- to high-density FPGA option within the ECP2M family, offering a mix of sizeable logic resources, embedded memory, and a large I/O count in a compact BGA package. It is well suited to engineering teams and procurement organizations designing commercial-grade embedded systems that need programmable logic for complex interfacing, control, and data buffering tasks.

Choosing this FPGA supports designs that require scalable programmable resources and consolidated on-chip memory, enabling reduced BOM complexity and straightforward board-level integration for a range of commercial applications.

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