LFE2M70SE-7FN1152C

The LFE2M70SE-7FN1152C is an ECP2M family field programmable gate array intended for commercial-grade applications. It integrates 67,000 logic elements and approximately 4.64 Mbits of embedded memory, delivering significant on-chip resources for complex logic and buffering requirements.

With 436 user I/Os, a 1152-BBGA (1152-FPBGA, 35×35) surface-mount package, and a core supply range of 1.14 V to 1.26 V, this device is designed to support dense I/O, memory, and logic integration within a compact footprint while operating across a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic Density — 67,000 logic elements providing substantial programmable logic capacity for medium- to high-density designs.
• Configurable Logic Blocks (CLBs) — 8,375 CLBs for flexible resource partitioning and hierarchical logic implementation.
• Embedded Memory — Approximately 4.64 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Capacity — 436 I/Os enabling extensive interfacing to peripherals, sensors, and external logic.
• Package & Mounting — 1152-BBGA (1152-FPBGA, 35×35) surface-mount package for high pin-count, compact board integration.
• Power — Core supply range of 1.14 V to 1.26 V for defined low-voltage operation.
• Operating Range & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Unique Advantages

• High on-chip integration: Large logic count and multi-megabit embedded RAM reduce dependence on external components and simplify board-level design.
• Extensive I/O capability: 436 I/Os support broad peripheral and system interfacing, enabling complex connectivity scenarios.
• Compact, high-density package: The 1152-BBGA (35×35) package delivers a high pin count in a small footprint for space-constrained designs.
• Defined low-voltage core: A narrow supply range (1.14 V–1.26 V) aids predictable power planning and integration with modern power architectures.
• Commercial temperature suitability: Specified for 0 °C to 85 °C operation to match typical commercial product deployment environments.
• Regulatory readiness: RoHS compliance supports use in lead-free manufacturing flows.

Why Choose LFE2M70SE-7FN1152C?

The LFE2M70SE-7FN1152C positions itself as a high-density, commercially graded FPGA that balances logic capacity, embedded memory, and I/O density within a compact 1152-BBGA footprint. Its resource set is appropriate for designers seeking to consolidate logic and memory on-chip while maintaining a broad interface capability.

This device is suited to teams and projects that require predictable power and thermal ranges, RoHS compatibility, and a substantial on-chip resource pool to reduce external BOM and simplify system architecture. It provides a scalable option within the ECP2M family for commercial FPGA-based designs.

If you would like pricing or availability information, request a quote or submit an inquiry and our team will respond with a formal quote and ordering details.