LFE3-150EA-6FN1156C

The LFE3-150EA-6FN1156C is an ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation offered in a 1156-BBGA surface-mount package. It provides a high logic capacity device with extensive I/O and embedded memory for designs that require substantial on-chip resources within a commercial-grade temperature range.

This device targets applications that benefit from large programmable logic capacity, significant embedded RAM, and flexible I/O availability while operating at a core supply from 1.14 V to 1.26 V and within 0 °C to 85 °C. The part is RoHS compliant and supplied in a 1156-FPBGA (35×35) package case footprint.

Key Features

• Logic Capacity 149,000 logic elements providing significant programmable logic for complex designs.
• Embedded Memory Approximately 7.0 Mbits of on-chip RAM to support buffering, packet processing, or intermediate data storage.
• I/O Density 586 I/O pins to accommodate wide interface requirements and multi-channel connectivity.
• Package & Mounting 1156-BBGA package (supplier device package: 1156-FPBGA 35×35) in a surface-mount form factor for compact board-level integration.
• Power Core voltage supply range from 1.14 V to 1.26 V for predictable power planning and system integration.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density signal processing Use the device’s large logic element count and embedded RAM to implement complex processing pipelines and data path logic.
• Interface aggregation Leverage 586 I/O pins to consolidate multiple peripheral and high-speed interfaces on a single FPGA.
• Embedded control systems Deploy as the programmable logic backbone in control and monitoring applications that require significant logic and memory resources.
• Prototyping and system integration Suitable for board-level designs that need a high-capacity, surface-mount FPGA with a compact BBGA footprint.

Unique Advantages

• High logic capacity: 149,000 logic elements enable implementation of complex finite-state machines, datapaths, and combinational logic without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 7.0 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O count: 586 I/O pins support multi-protocol designs, multiple peripherals, and parallel interfaces on a single device.
• Compact, manufacturable package: 1156-BBGA surface-mount package with a 35×35 supplier footprint supports high-density PCB layouts and automated assembly.
• Predictable power planning: Defined core voltage range (1.14 V–1.26 V) simplifies supply design and power sequencing.
• Regulatory readiness: RoHS compliance supports environmentally conscious product builds.

Why Choose LFE3-150EA-6FN1156C?

The LFE3-150EA-6FN1156C positions itself as a high-capacity, I/O-rich FPGA suitable for commercial embedded systems that demand substantial programmable logic and on-chip memory. Its combination of 149,000 logic elements, approximately 7.0 Mbits of embedded RAM, and 586 I/O pins delivers a balance of integration and flexibility for complex designs.

This device is well suited to engineers and procurement teams building compact, surface-mount products that require robust logic resources within a commercial operating range, backed by Lattice Semiconductor’s ECP3 family architecture and RoHS compliance for environmentally compliant production.

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