LFE3-150EA-6FN1156I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA |
|---|---|
| Quantity | 1,738 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 586 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-6FN1156I – ECP3 FPGA, 149,000 logic elements, 586 I/Os, 1156-BBGA
The LFE3-150EA-6FN1156I is a Lattice ECP3 family field-programmable gate array (FPGA) device featuring reconfigurable SRAM-based logic and a 65 nm process architecture. Built for high-density logic, extensive I/O and embedded DSP resources, it targets high-volume, high-speed applications that require integration of SERDES, DSP and flexible memory in an industrial-grade package.
Key Features
- Logic Capacity — 149,000 logic elements providing large-scale LUT-based logic for complex digital designs.
- Embedded Memory — Approximately 7.01 Mbits of on-chip RAM (total RAM bits: 7,014,400) to support buffering, packet processing and local data storage.
- High‑Speed SERDES — Family-level embedded SERDES support with channel data rates up to 3.2 Gbps and multi-protocol capability (examples shown in family documentation include PCIe, Ethernet, SONET/SDH, CPRI and Serial RapidIO).
- sysDSP & Multiply Resources — Hardware DSP slice architecture and abundant multipliers (ECP3-150 family shows up to 320 18×18 multipliers) for high-performance multiply-accumulate and signal processing workloads.
- Flexible I/O — 586 user I/Os with programmable buffer standards and source-synchronous support for DDR interfaces and ADC/DAC connectivity.
- Clocking and Timing — Multiple PLLs and DLLs available per device family for robust clock management and timing control.
- Package & Mounting — 1156-BBGA package; supplier device package listed as 1156-FPBGA (35 × 35 mm), surface-mount.
- Power & Operating Range — Core supply range specified at 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 100 °C.
- Standards & Compliance — RoHS compliant and supports flexible configuration options (dual-boot images, SPI boot flash, soft error detect macros as documented for the family).
Typical Applications
- Telecommunications & Networking — High-speed packet processing and line interfaces using embedded SERDES and extensive user I/O for protocols such as Ethernet and PCIe.
- Broadcast & Video Transport — SMPTE 3G and high-speed ADC/DAC interfacing with on-chip DSP resources for video processing and timing-critical data paths.
- Data Acquisition & Signal Processing — DSP slices and abundant multipliers enable real-time filtering, FFTs and other compute-heavy signal-processing tasks.
- Industrial Systems — Industrial-grade temperature range and robust I/O options suit automated test, control and instrumentation applications requiring extended ambient operation.
Unique Advantages
- High Logic Density: 149,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- Large On‑Chip Memory: Approximately 7.01 Mbits of embedded RAM support deep buffering and on-chip data storage for high-throughput designs.
- Integrated High‑Speed SERDES: Multi-gigabit serial channels and family-level support for common serial protocols simplify high-speed link implementations.
- Dedicated DSP Resources: Extensive multiplier resources and cascadable sysDSP slices accelerate multiply-accumulate and advanced arithmetic operations.
- Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in demanding environmental conditions.
- Compact, High‑Pin Package: 1156-ball BBGA (35 × 35 mm) provides high I/O count (586) in a single surface-mount footprint.
Why Choose LFE3-150EA-6FN1156I?
The LFE3-150EA-6FN1156I offers a balanced combination of high logic capacity, substantial embedded memory and dedicated DSP/SERDES resources in an industrial-grade FPGA package. It is well suited for designs that require integration of high-speed serial connectivity, real-time signal processing and large I/O counts while maintaining a compact board footprint.
Designers and system architects seeking a scalable, robust FPGA solution for networking, broadcast, industrial control or data acquisition applications can rely on the documented family features and the device’s specified operating range, supply requirements and package options to plan system-level integration and long-term deployment.
Request a quote or submit an inquiry for pricing and availability of LFE3-150EA-6FN1156I to move your design forward.