LFE3-150EA-6LFN1156C

The LFE3-150EA-6LFN1156C is a high-density Lattice ECP3 FPGA in a 1156-BBGA package optimized for system integration and high-speed I/O. It provides a large programmable fabric with 149,000 logic elements, extensive on-chip RAM, and flexible SERDES and I/O resources for communications, signal processing and embedded system designs.

Designed for commercial-grade applications, this surface-mount FPGA delivers a balance of performance and integration with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  149,000 logic elements (LUT-based fabric) for implementing complex digital logic and control functions.
• On-chip Memory  7,014,400 bits of total embedded RAM for frame buffering, packet buffering and local data storage.
• High I/O Count  Up to 586 user I/Os to support wide bus interfaces, multiple peripherals, and large external connectivity requirements.
• Embedded SERDES  Multi-gigabit transceivers supporting data rates from 150 Mbps to 3.2 Gbps and up to 16 channels per device for high-speed serial protocols.
• sysDSP™ Slices  Dedicated DSP slice architecture with up to 160 slices supporting wide multiply-accumulate operations suitable for real-time signal processing.
• Memory Architecture  Flexible memory resources including embedded block RAM and distributed RAM for diverse buffering and storage needs.
• Programmable sysI/O™  I/O buffer support for a broad set of standards with on-chip termination and optional input equalization.
• Clocking Resources  Up to ten PLLs and two DLLs to support multiple clock domains and precise timing control.
• Package & Mounting  1156-FPBGA (35 × 35 mm) package, surface-mount mounting type for board-level integration.
• Commercial Grade & Compliance  Commercial operating temperature (0 °C to 85 °C) and RoHS compliant.
• Power  Core voltage supply range: 1.14 V to 1.26 V for compatibility with 1.2 V core systems.

Typical Applications

• High‑speed Communications  Use the on‑chip SERDES and multi‑Gbps channel support for PCI Express, Ethernet, SONET/SDH, CPRI and other serial link applications.
• Real‑time Signal Processing  Leverage the sysDSP slices and abundant multipliers for video processing, DSP filtering and high‑performance MAC workloads.
• Memory Interface and Buffering  Implement DDR/DDR2/DDR3 interface logic, buffering and read/write leveling using dedicated source‑synchronous I/O support.
• Embedded System Control  Utilize large logic capacity and plentiful I/Os for protocol bridging, system control functions and complex state machines.

Unique Advantages

• High Logic Density: 149,000 logic elements provide headroom for integrating multiple system functions into a single device, reducing board-level BOM.
• Robust On‑Chip Memory: Over 7 million bits of embedded RAM enable significant local storage for buffering, packet queuing and frame memory without external RAM.
• Extensive I/O and SERDES: Up to 586 I/Os and multi‑Gbps SERDES channels support broad connectivity options and high‑speed serial protocols.
• Dedicated DSP Resources: sysDSP slices and numerous 18×18 multipliers accelerate multiply‑accumulate workloads, improving throughput for signal processing tasks.
• Flexible Clocking and I/O: Multiple PLLs/DLLs and programmable sysI/O buffers simplify multi‑clock designs and support a wide range of interface standards.
• Commercial Readiness: Surface‑mount 1156‑BBGA package and RoHS compliance support standard manufacturing flows for commercial products.

Why Choose LFE3-150EA-6LFN1156C?

The LFE3-150EA-6LFN1156C combines large FPGA fabric, substantial embedded memory and high-speed I/O in a single 1156‑BBGA package, making it suitable for designs that require integration of communications, signal processing and control logic. Its mix of logic density, dedicated DSP resources and configurable SERDES channels enables consolidation of multi‑function subsystems into one device.

This part is well suited to engineering teams building commercial embedded systems that need predictable operating range, flexible interfacing and on‑chip resources to reduce external components while maintaining design scalability and reliability supported by Lattice ECP3 family features.

Request a quote or submit a procurement inquiry for the LFE3-150EA-6LFN1156C to evaluate it for your next design.