LFE3-150EA-7FN1156C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA |
|---|---|
| Quantity | 77 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 586 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-7FN1156C – ECP3 Field Programmable Gate Array (FPGA) IC
The LFE3-150EA-7FN1156C is an ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a high logic element count and substantial on-chip RAM in a compact 1156-BBGA surface-mount package.
Key device characteristics include 149,000 logic elements, approximately 7.01 Mbits of embedded memory, 586 I/Os, a 1.14 V to 1.26 V supply range, and a commercial operating temperature rating of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core and Logic — 149,000 logic elements provide wide digital integration capacity for complex hardware designs.
- Embedded Memory — Approximately 7.01 Mbits of on-chip RAM to support buffering, frame storage, and embedded-data structures.
- I/O Count — 586 available I/Os to accommodate dense peripheral connectivity and multi-channel interfaces.
- Power — Operates from a 1.14 V to 1.26 V supply range for core power domains.
- Package and Mounting — Supplied in a 1156-BBGA package (1156-FPBGA, 35 × 35 mm) designed for surface-mount assembly.
- Temperature and Grade — Commercial grade with an operating range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High integration density: 149,000 logic elements enable consolidation of multiple functions into a single silicon device, reducing board-level components.
- Substantial on-chip RAM: Approximately 7.01 Mbits of embedded memory supports data buffering and memory-intensive logic without external RAM.
- Extensive I/O availability: 586 I/Os allow flexible interfacing to numerous peripherals and multiport systems.
- Compact, surface-mount package: The 1156-BBGA (35 × 35 mm) package balances a small footprint with high pin count for dense PCB layouts.
- Low-voltage core operation: A narrow 1.14 V to 1.26 V supply range supports predictable core power design and domain planning.
- Commercial temperature rating and compliance: 0 °C to 85 °C operating range and RoHS compliance support standard commercial applications and regulatory expectations.
Why Choose LFE3-150EA-7FN1156C?
The LFE3-150EA-7FN1156C combines a high logic element count, large embedded memory, and a very high I/O count in a compact 1156-BBGA surface-mount package, positioning it for designs that require significant on-chip resources and dense external connectivity. Its specified supply range and commercial operating temperature make it suitable for a wide set of commercial electronic applications.
As an ECP3-family FPGA from Lattice Semiconductor Corporation, this device is a practical choice for engineers seeking a single-chip solution that delivers integration and predictable electrical and thermal operating characteristics.
Request a quote or submit a quote today to check pricing and availability for the LFE3-150EA-7FN1156C.
