LFE3-150EA-7FN672C

The LFE3-150EA-7FN672C is a Field Programmable Gate Array (FPGA) in a 672-BBGA package, offering a balance of programmable logic capacity, on-chip memory and I/O integration for commercial applications. With 149,000 logic elements, approximately 7.01 Mbits of embedded memory and 380 I/O, this device targets designs that require substantial logic density and flexible interfacing while operating from a 1.14 V to 1.26 V supply and a commercial temperature range.

Key Features

• Core Logic 149,000 logic elements provide a large programmable fabric for implementing complex logic, custom datapaths and control functions.
• Embedded Memory Approximately 7.01 Mbits of on-chip RAM to support buffering, state storage and algorithm acceleration without external memory.
• I/O Integration 380 I/O pins enable extensive external interfacing options for peripherals, sensors and high-density connectors.
• Power Supply Operates from a 1.14 V to 1.26 V core supply range to match system power rails and design constraints.
• Package and Mounting 672-BBGA package (Supplier device package: 672-FPBGA (27x27)) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Commercial-grade device rated for 0°C to 85°C operation, suitable for standard commercial environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Protocol Bridging and Interface Conversion Use the device's 380 I/O and large logic capacity to implement custom interface adapters and protocol translators on a single chip.
• Embedded Processing and Acceleration Leverage 149,000 logic elements and ~7.01 Mbits of embedded memory for offloading compute-heavy tasks or building hardware accelerators.
• Prototyping and System Integration Compact 672-BBGA surface-mount packaging makes the device suitable for development boards and integration into space-constrained commercial products.

Unique Advantages

• High Logic Density: 149,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing overall BOM.
• Substantial On-chip Memory: Approximately 7.01 Mbits of RAM lowers dependence on external memory and simplifies timing and routing considerations.
• Extensive I/O Count: 380 I/O pins provide flexibility to connect a wide range of peripherals and interfaces without additional expander chips.
• Compact Surface-Mount Package: 672-BBGA (672-FPBGA (27x27)) packaging supports dense PCB layouts and modern assembly processes.
• Commercial Temperature Range: Rated for 0°C to 85°C, suitable for typical commercial electronic applications and environments.
• RoHS Compliant: Meets common environmental requirements for electronics manufacturing.

Why Choose LFE3-150EA-7FN672C?

The LFE3-150EA-7FN672C positions itself as a commercially graded FPGA option that combines large programmable logic capacity, meaningful on-chip memory and broad I/O in a compact surface-mount BBGA package. It is well suited for designers who need to integrate complex logic functions, interface-rich systems and memory-intensive tasks while maintaining a small PCB footprint and standard commercial operating conditions.

For teams focused on scalable, integrated designs, this device delivers a balance of logic, memory and I/O that supports consolidation of discrete components and streamlined board-level integration, backed by RoHS compliance for manufacturing readiness.

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