LFE3-150EA-7LFN672C

The LFE3-150EA-7LFN672C is an ECP3 family field programmable gate array from Lattice Semiconductor Corporation packaged in a 672-BBGA surface-mount package. It delivers a mid-to-high density programmable logic fabric with a commercial-grade operating range.

This device integrates 149,000 logic elements and approximately 7.0 Mbits of on-chip RAM, alongside 380 user I/O pins and a low-voltage core supply range (1.14 V to 1.26 V). Its specified operating temperature range is 0°C to 85°C, and it is RoHS compliant.

Key Features

• Core Logic Density – 18,625 CLBs (configurable logic blocks) providing 149,000 logic elements for implementing complex digital functions.
• Embedded Memory – Approximately 7.0 Mbits of on-chip RAM (7,014,400 bits) for buffering, state storage, and intermediate data processing.
• I/O Capacity – 380 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power – Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match low-voltage system domains.
• Package & Mounting – 672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) designed for surface-mount assembly.
• Operating Range & Compliance – Commercial grade operation from 0°C to 85°C and RoHS compliant for environmentally conscious designs.

Typical Applications

• High-density I/O control – Use the 380 I/O pins to implement multi-channel interfaces, parallel buses, or I/O aggregation in compact systems.
• On-chip buffering and memory acceleration – Leverage approximately 7.0 Mbits of embedded RAM for packet buffering, FIFO buffering, or temporary data storage.
• Custom digital logic integration – Deploy the 149,000 logic elements to implement glue logic, protocol conversion, or user-defined datapaths in commercial designs.

Unique Advantages

• Significant logic resources: 149,000 logic elements enable implementation of complex combinational and sequential designs without external logic expansion.
• Substantial embedded memory: Approximately 7.0 Mbits of on-chip RAM reduces the need for external memory in many buffering and state-storage tasks.
• High I/O count: 380 I/O pins provide flexibility for interfacing to multiple peripherals and parallel interfaces, simplifying board-level routing choices.
• Compact package: 672-BBGA (27 × 27 mm supplier FPBGA) offers a small footprint for high-density designs while supporting surface-mount assembly.
• Commercial temperature rating: Specified for 0°C to 85°C operation to match standard commercial electronic product requirements.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing processes.

Why Choose LFE3-150EA-7LFN672C?

The LFE3-150EA-7LFN672C positions itself as a capable, commercial-grade ECP3 FPGA option for designers needing a balance of logic density, embedded memory, and high I/O capacity in a compact BG A package. Its combination of 149,000 logic elements, roughly 7.0 Mbits of RAM, and 380 I/Os makes it suitable for projects that require substantial on-chip resources without moving to larger, more power-hungry devices.

Choose this device when you need a programmable logic solution that provides scalable integration, a compact 672-BBGA footprint, and compliance with RoHS and commercial temperature ranges. Its specifications support a range of mid- to high-complexity commercial designs and help reduce external component count while maintaining design flexibility.

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