LFE3-150EA-8FN1156I

IC FPGA 586 I/O 1156FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA

Quantity 1,167 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O586Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18625Number of Logic Elements/Cells149000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7014400

Overview of LFE3-150EA-8FN1156I – ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA

The LFE3-150EA-8FN1156I is a Lattice ECP3 family FPGA optimized for high-performance, cost-conscious system integration. Built on the ECP3 architecture, it combines a large logic fabric, extensive embedded memory, high-speed SERDES and flexible I/O to address applications requiring dense logic, DSP capability and multi‑protocol serial connectivity.

Typical markets include high-volume communications, industrial systems and signal-processing applications where integration, performance and an industrial operating range are required.

Key Features

  • Logic Capacity — 149,000 logic elements for complex programmable logic and control functions.
  • Embedded Memory — Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) for large frame buffers, FIFOs and data storage.
  • High-Speed SERDES — Embedded SERDES supporting 150 Mbps to 3.2 Gbps for generic 8b10b/10-bit/8-bit modes and data rates of 230 Mbps to 3.2 Gbps per channel for other protocols; device-level support for multi-channel serial links.
  • DSP and Multiplier Resources — sysDSP architecture with cascadable slices and support for high-performance MAC operations; device provides up to 320 18×18 multipliers.
  • Clocking and Timing — Multiple analog PLLs and DLLs (ECP3-150 supports up to 10 PLLs and 2 DLLs) to support complex timing and clock domain management.
  • Flexible sysI/O — 586 user I/Os with a wide range of supported I/O standards, on‑chip termination and source-synchronous features for memory and high-speed interfaces.
  • Configuration and System Tools — Family-level support includes configuration utilities and on-chip features for device configuration and diagnostics.
  • Package & Mounting — 1156-BBGA (supplier package: 1156-FPBGA, 35×35 mm) in a surface-mount form factor.
  • Power and Temperature — Core/operating supply range 1.14 V to 1.26 V; rated for operation from −40 °C to 100 °C. RoHS compliant and specified as Industrial grade.

Typical Applications

  • High-Speed Serial Connectivity — Implement multi‑protocol links such as PCI Express, Ethernet variants and other SERDES-based protocols using the device’s high-speed transceivers and abundant I/O.
  • Signal Processing and DSP — Leverage the sysDSP slices and 320 18×18 multipliers for real-time filtering, accumulation and other compute‑intensive operations.
  • Memory Interface and Buffering — Use the device’s embedded memory and source-synchronous I/O support for DDR/DDR2/DDR3 memory interfaces and large data buffering.
  • Industrial Control Systems — Industrial temperature rating and robust I/O options make the device suitable for motor control, automation and sensor-aggregation designs.

Unique Advantages

  • High integration density: 149,000 logic elements and ~7.01 Mbits of on-chip RAM reduce the need for external logic and memory, simplifying BOM and board layout.
  • Multi‑protocol serial capability: Embedded SERDES with broad data-rate support enable flexible deployment across a range of serial standards and link topologies.
  • Dedicated DSP resources: Extensive multiplier resources and cascadable sysDSP slices accelerate multiply‑accumulate workloads and reduce reliance on external DSP processors.
  • Flexible clocking: Multiple PLLs/DLLs provide the clocking granularity required for complex multi‑domain designs.
  • Ruggedized for industrial use: Surface-mount 1156-BBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.
  • Comprehensive I/O options: 586 programmable I/Os with on-chip termination and source-synchronous support provide broad interface compatibility.

Why Choose LFE3-150EA-8FN1156I?

The LFE3-150EA-8FN1156I brings together sizable logic capacity, significant embedded memory and robust DSP and SERDES resources in a single industrial‑grade FPGA package. It is positioned for designs that demand high integration, flexible high-speed I/O and sustained operation across industrial temperature ranges.

Designers benefit from the ECP3 family’s architectural features—dedicated DSP slices, abundant multipliers, extensive PLL/DLL resources and configurable I/O—making this device suitable for communications, industrial control and signal-processing systems that require scalable performance and proven platform utilities.

Request a quote or submit an RFQ to initiate procurement or to discuss volume pricing and availability for the LFE3-150EA-8FN1156I.

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