LFE3-150EA-8FN1156I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA |
|---|---|
| Quantity | 1,167 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 586 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-8FN1156I – ECP3 Field Programmable Gate Array (FPGA) IC 586 7014400 149000 1156-BBGA
The LFE3-150EA-8FN1156I is a Lattice ECP3 family FPGA optimized for high-performance, cost-conscious system integration. Built on the ECP3 architecture, it combines a large logic fabric, extensive embedded memory, high-speed SERDES and flexible I/O to address applications requiring dense logic, DSP capability and multi‑protocol serial connectivity.
Typical markets include high-volume communications, industrial systems and signal-processing applications where integration, performance and an industrial operating range are required.
Key Features
- Logic Capacity — 149,000 logic elements for complex programmable logic and control functions.
- Embedded Memory — Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) for large frame buffers, FIFOs and data storage.
- High-Speed SERDES — Embedded SERDES supporting 150 Mbps to 3.2 Gbps for generic 8b10b/10-bit/8-bit modes and data rates of 230 Mbps to 3.2 Gbps per channel for other protocols; device-level support for multi-channel serial links.
- DSP and Multiplier Resources — sysDSP architecture with cascadable slices and support for high-performance MAC operations; device provides up to 320 18×18 multipliers.
- Clocking and Timing — Multiple analog PLLs and DLLs (ECP3-150 supports up to 10 PLLs and 2 DLLs) to support complex timing and clock domain management.
- Flexible sysI/O — 586 user I/Os with a wide range of supported I/O standards, on‑chip termination and source-synchronous features for memory and high-speed interfaces.
- Configuration and System Tools — Family-level support includes configuration utilities and on-chip features for device configuration and diagnostics.
- Package & Mounting — 1156-BBGA (supplier package: 1156-FPBGA, 35×35 mm) in a surface-mount form factor.
- Power and Temperature — Core/operating supply range 1.14 V to 1.26 V; rated for operation from −40 °C to 100 °C. RoHS compliant and specified as Industrial grade.
Typical Applications
- High-Speed Serial Connectivity — Implement multi‑protocol links such as PCI Express, Ethernet variants and other SERDES-based protocols using the device’s high-speed transceivers and abundant I/O.
- Signal Processing and DSP — Leverage the sysDSP slices and 320 18×18 multipliers for real-time filtering, accumulation and other compute‑intensive operations.
- Memory Interface and Buffering — Use the device’s embedded memory and source-synchronous I/O support for DDR/DDR2/DDR3 memory interfaces and large data buffering.
- Industrial Control Systems — Industrial temperature rating and robust I/O options make the device suitable for motor control, automation and sensor-aggregation designs.
Unique Advantages
- High integration density: 149,000 logic elements and ~7.01 Mbits of on-chip RAM reduce the need for external logic and memory, simplifying BOM and board layout.
- Multi‑protocol serial capability: Embedded SERDES with broad data-rate support enable flexible deployment across a range of serial standards and link topologies.
- Dedicated DSP resources: Extensive multiplier resources and cascadable sysDSP slices accelerate multiply‑accumulate workloads and reduce reliance on external DSP processors.
- Flexible clocking: Multiple PLLs/DLLs provide the clocking granularity required for complex multi‑domain designs.
- Ruggedized for industrial use: Surface-mount 1156-BBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.
- Comprehensive I/O options: 586 programmable I/Os with on-chip termination and source-synchronous support provide broad interface compatibility.
Why Choose LFE3-150EA-8FN1156I?
The LFE3-150EA-8FN1156I brings together sizable logic capacity, significant embedded memory and robust DSP and SERDES resources in a single industrial‑grade FPGA package. It is positioned for designs that demand high integration, flexible high-speed I/O and sustained operation across industrial temperature ranges.
Designers benefit from the ECP3 family’s architectural features—dedicated DSP slices, abundant multipliers, extensive PLL/DLL resources and configurable I/O—making this device suitable for communications, industrial control and signal-processing systems that require scalable performance and proven platform utilities.
Request a quote or submit an RFQ to initiate procurement or to discuss volume pricing and availability for the LFE3-150EA-8FN1156I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016