LFE3-150EA-8LFN1156C

The LFE3-150EA-8LFN1156C is a field-programmable gate array (FPGA) IC from Lattice Semiconductor’s ECP3 family. It delivers a high-density, reconfigurable fabric with 149,000 logic elements and a large I/O complement for system integration in commercial applications.

Designed for high-speed serial interfaces, embedded DSP processing and flexible memory configurations, this device supports use cases such as communications, video/broadcast processing, and high-performance embedded systems that require substantial logic, memory and I/O resources.

Key Features

• Core Capacity — 149,000 logic elements providing extensive LUT-based logic resources for complex designs.
• Embedded Memory — Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) for large buffering and local storage.
• High I/O Count — Up to 586 user I/Os to support dense external interfacing and multiple parallel channels.
• Embedded DSP and Multipliers — Up to 320 18×18 multipliers and a sysDSP architecture offering cascaded slices and wide ALU support for multiply-accumulate operations.
• High-Speed SERDES — Embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps and up to 16 channels per device for protocols such as PCI Express, SONET/SDH, Ethernet, CPRI, SMPTE 3G and Serial RapidIO.
• Clocking and Timing — Integrated clock resources including two DLLs and up to ten PLLs to support complex clocking requirements.
• Flexible I/O Standards — Programmable I/O buffer with on-chip termination and broad standard support (LVTTL, LVCMOS, SSTL, HSTL, LVDS and others) and source-synchronous DDR support.
• Power and Operating Range — Core voltage supply range of 1.14 V to 1.26 V and commercial operating temperature range from 0 °C to 85 °C.
• Package — 1156-ball BGA package (35 × 35 mm) suitable for surface-mount assembly (supplier device package: 1156-FPBGA).
• Configuration and System Support — Supports SPI boot flash interface, dual-boot images, soft error detect macros, and on-chip oscillator for initialization and general use.
• Compliance — RoHS compliant.

Typical Applications

• High-speed Networking Equipment — Implement multi-protocol serial links (Ethernet, PCIe, Serial RapidIO) using the device’s embedded SERDES and large I/O complement.
• Broadcast and Video Processing — Support SMPTE 3G and related video interfaces with the FPGA’s high-speed interfaces, abundant logic and embedded memory for frame buffering and processing.
• Telecommunications and Wireless Infrastructure — Use the device for CPRI, SONET/SDH or backhaul interfaces leveraging SERDES channels, PLLs and timing resources.
• DSP-Intensive Embedded Systems — Offload compute-heavy algorithms to sysDSP slices and numerous 18×18 multipliers for signal processing and real-time math operations.

Unique Advantages

• Highly integrated resource set: 149,000 logic elements, approximately 7.01 Mbits of embedded memory and up to 586 I/Os reduce the need for external logic and memory, simplifying board-level design.
• Broad serial connectivity: Embedded SERDES with multi-gigabit capability and protocol support enable flexible high-speed link implementation without additional transceiver chips.
• Optimized DSP throughput: Extensive multiplier resources and sysDSP architecture accelerate multiply-accumulate workloads and complex arithmetic functions.
• Flexible clocking and I/O: Multiple PLLs/DLLs and a programmable I/O buffer set provide precise clock management and wide interface compatibility for system-level timing challenges.
• Commercial-grade readiness: Commercial operating range (0 °C to 85 °C) and surface-mount 1156-BBGA packaging match standard production environments and assembly flows.

Why Choose LFE3-150EA-8LFN1156C?

The LFE3-150EA-8LFN1156C positions itself as a high-capacity, commercially graded FPGA offering substantial logic, memory and I/O resources for demanding embedded and communications designs. Its combination of embedded SERDES, a powerful DSP architecture and flexible memory makes it suitable for applications that require dense integration of serial links, signal processing and interface logic.

This device is well suited to engineering teams seeking a robust FPGA platform that balances high logic density and plentiful I/O with comprehensive on-chip resources and configuration options, enabling scalable designs and streamlined system integration.

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