LFE3-150EA-8LFN672C

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA

Quantity 401 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18625Number of Logic Elements/Cells149000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7014400

Overview of LFE3-150EA-8LFN672C – ECP3 FPGA, 149,000 logic elements, 672-BBGA

The LFE3-150EA-8LFN672C is a Lattice ECP3 family field-programmable gate array (FPGA) in a 672-BBGA surface-mount package. It integrates a large FPGA fabric with high I/O density and embedded memory to support complex logic, high-speed serial interfaces, and on-chip DSP functions.

This commercial-grade device is targeted at applications requiring extensive programmable logic and memory—delivering 149,000 logic elements, approximately 7.01 Mbits of on-chip RAM, and 380 user I/Os in a 27×27 mm 672-FPBGA package.

Key Features

  • Logic Capacity — 149,000 logic elements for implementing complex state machines, connectivity logic, and custom datapaths.
  • Embedded Memory — Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) to support large buffers, FIFOs, and scratchpad storage.
  • I/O and High-Speed Serial — 380 user I/Os in the 672-BBGA package; family-level SERDES capabilities and high-speed serial support are provided for common serial protocols and multigigabit links.
  • DSP Resources — Family architecture includes optimized DSP slices and multipliers for high-performance multiply-accumulate operations (refer to family datasheet for slice details).
  • Programmability & System Support — Supports flexible configuration options and system utilities provided by the ECP3 family (including on-chip oscillators, PLLs/DLLs, and configuration interfaces per the series datasheet).
  • Power & Voltage — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and allow predictable power budgeting.
  • Package & Mounting — 672-FPBGA (27 × 27 mm) supplier package, surface-mount mounting type for high-density board designs.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature; RoHS compliant.

Typical Applications

  • Networking & Telecom — Implement protocol bridging, packet processing, and medium-to-high-speed serial interfaces using on-chip logic, memory, and SERDES capabilities.
  • Video & Imaging — Use abundant logic and embedded RAM for video frame buffering, preprocessing pipelines, and timing-sensitive data paths.
  • Industrial Automation — Deploy as a flexible control and I/O aggregation device where high I/O count and bespoke logic functions are required within commercial temperature environments.
  • Embedded Compute & Acceleration — Offload deterministic processing kernels using the FPGA fabric and DSP resources for custom acceleration and realtime data handling.

Unique Advantages

  • High Logic Density: 149,000 logic elements enable large-scale integration of control, interface, and processing functions on a single device, reducing BOM complexity.
  • Substantial On-Chip Memory: Approximately 7.01 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory dependence.
  • Dense I/O in a Compact Package: 380 I/Os in a 27×27 mm 672-FPBGA balance board area efficiency with high interface count for mixed-signal and digital systems.
  • Commercial Temperature Suitability: Rated 0 °C to 85 °C for mainstream applications and environments typical of consumer and many industrial electronics.
  • RoHS Compliant: Meets RoHS requirements for environmentally-conscious manufacturing and supply-chain compliance.
  • Surface-Mount Package: 672-BBGA surface-mount form factor supports automated assembly and high-volume manufacturing.

Why Choose LFE3-150EA-8LFN672C?

This Lattice ECP3-based FPGA offers a balanced combination of large programmable logic capacity, substantial on-chip memory, and high I/O count in a compact surface-mount 672-BBGA package. It is well suited for designers who need to consolidate functions, implement custom high-throughput data paths, or accelerate deterministic processing within commercial-temperature systems.

Choosing this device provides a scalable platform within the ECP3 family, with ecosystem support and family-level features that ease integration of serial interfaces, DSP functions, and flexible configuration options for production designs.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the LFE3-150EA-8LFN672C. Our team can assist with volume needs and technical questions to support your evaluation and deployment.

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