LFE3-150EA-8LFN672C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 380 7014400 149000 672-BBGA |
|---|---|
| Quantity | 401 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 380 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18625 | Number of Logic Elements/Cells | 149000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7014400 |
Overview of LFE3-150EA-8LFN672C – ECP3 FPGA, 149,000 logic elements, 672-BBGA
The LFE3-150EA-8LFN672C is a Lattice ECP3 family field-programmable gate array (FPGA) in a 672-BBGA surface-mount package. It integrates a large FPGA fabric with high I/O density and embedded memory to support complex logic, high-speed serial interfaces, and on-chip DSP functions.
This commercial-grade device is targeted at applications requiring extensive programmable logic and memory—delivering 149,000 logic elements, approximately 7.01 Mbits of on-chip RAM, and 380 user I/Os in a 27×27 mm 672-FPBGA package.
Key Features
- Logic Capacity — 149,000 logic elements for implementing complex state machines, connectivity logic, and custom datapaths.
- Embedded Memory — Total on-chip RAM of 7,014,400 bits (approximately 7.01 Mbits) to support large buffers, FIFOs, and scratchpad storage.
- I/O and High-Speed Serial — 380 user I/Os in the 672-BBGA package; family-level SERDES capabilities and high-speed serial support are provided for common serial protocols and multigigabit links.
- DSP Resources — Family architecture includes optimized DSP slices and multipliers for high-performance multiply-accumulate operations (refer to family datasheet for slice details).
- Programmability & System Support — Supports flexible configuration options and system utilities provided by the ECP3 family (including on-chip oscillators, PLLs/DLLs, and configuration interfaces per the series datasheet).
- Power & Voltage — Core voltage supply range of 1.14 V to 1.26 V to match system power rails and allow predictable power budgeting.
- Package & Mounting — 672-FPBGA (27 × 27 mm) supplier package, surface-mount mounting type for high-density board designs.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature; RoHS compliant.
Typical Applications
- Networking & Telecom — Implement protocol bridging, packet processing, and medium-to-high-speed serial interfaces using on-chip logic, memory, and SERDES capabilities.
- Video & Imaging — Use abundant logic and embedded RAM for video frame buffering, preprocessing pipelines, and timing-sensitive data paths.
- Industrial Automation — Deploy as a flexible control and I/O aggregation device where high I/O count and bespoke logic functions are required within commercial temperature environments.
- Embedded Compute & Acceleration — Offload deterministic processing kernels using the FPGA fabric and DSP resources for custom acceleration and realtime data handling.
Unique Advantages
- High Logic Density: 149,000 logic elements enable large-scale integration of control, interface, and processing functions on a single device, reducing BOM complexity.
- Substantial On-Chip Memory: Approximately 7.01 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory dependence.
- Dense I/O in a Compact Package: 380 I/Os in a 27×27 mm 672-FPBGA balance board area efficiency with high interface count for mixed-signal and digital systems.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C for mainstream applications and environments typical of consumer and many industrial electronics.
- RoHS Compliant: Meets RoHS requirements for environmentally-conscious manufacturing and supply-chain compliance.
- Surface-Mount Package: 672-BBGA surface-mount form factor supports automated assembly and high-volume manufacturing.
Why Choose LFE3-150EA-8LFN672C?
This Lattice ECP3-based FPGA offers a balanced combination of large programmable logic capacity, substantial on-chip memory, and high I/O count in a compact surface-mount 672-BBGA package. It is well suited for designers who need to consolidate functions, implement custom high-throughput data paths, or accelerate deterministic processing within commercial-temperature systems.
Choosing this device provides a scalable platform within the ECP3 family, with ecosystem support and family-level features that ease integration of serial interfaces, DSP functions, and flexible configuration options for production designs.
Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the LFE3-150EA-8LFN672C. Our team can assist with volume needs and technical questions to support your evaluation and deployment.