LFE3-150EA-8LFN672I

The LFE3-150EA-8LFN672I is an industrial-grade ECP3 family FPGA optimized for high-density, high-performance embedded logic. It provides a large programmable fabric with 149,000 logic elements, extensive on-chip memory and high-speed I/O to support communications, signal processing and complex control applications.

Designed for surface-mount applications in a 672-ball BGA (27 × 27 mm) package, this device balances integration and flexibility for system designs that require abundant I/O, DSP capability and robust operating range.

Key Features

• Logic Density  149,000 logic elements for implementing sizable FPGA designs and complex state machines.
• Embedded Memory  Approximately 7.01 Mbits of on-chip RAM (7,014,400 bits) to support buffering, packet processing and on-chip data storage.
• High I/O Count  380 user I/Os in the 672-ball BGA package for broad peripheral and bus connectivity.
• High-Speed SERDES and Protocol Support  Family-level embedded SERDES support with data rates from 150 Mbps to 3.2 Gbps for serial interfaces and multi-channel links.
• Enhanced DSP Resources  Family sysDSP architecture (slice-based DSP blocks and wide ALU capabilities) for multiply-accumulate and signal-processing tasks.
• Flexible sysI/O™  Programmable I/O buffer options and on-chip termination that support a wide range of I/O standards for interface flexibility.
• Power and Clocking  Core supply range 1.14 V to 1.26 V and dedicated on-chip PLL/DLL resources for clock management.
• Industrial Reliability  Rated for operation from −40 °C to 100 °C and supplied in a surface-mount 672-FPBGA package suitable for industrial applications.
• RoHS Compliant  Environmentally compliant to support lead-free manufacturing processes.

Typical Applications

• High-Speed Communications  Use the device’s high I/O count and SERDES capability for multi-gigabit links, protocol bridging and network interface functions.
• Signal Processing and Video  Leverage embedded memory and sysDSP resources for real-time filtering, encoding/decoding and broadcast/video transport processing.
• Industrial Networking and Control  Industrial temperature rating, abundant I/O and flexible interface standards make it suitable for industrial automation gateways and control systems.
• Embedded System Integration  High logic density and on-chip memory enable consolidation of glue logic, peripherals and custom accelerators into a single device.

Unique Advantages

• High Logic Capacity: 149,000 logic elements enable complex, integrated designs that reduce the number of discrete components.
• Substantial On-Chip Memory: Approximately 7.01 Mbits of embedded RAM reduces external memory dependence and simplifies board layout.
• Broad I/O and Packaging: 380 user I/Os in a 672-ball FPBGA (27 × 27 mm) package provide extensive connectivity while keeping a compact board footprint.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in demanding industrial environments.
• Flexible High-Speed Interfaces: Embedded SERDES and programmable sysI/O support a wide set of serial and parallel interface standards for versatile system integration.
• Regulatory and Process Readiness: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose LFE3-150EA-8LFN672I?

This FPGA delivers a balance of logic density, on-chip memory and high-speed I/O for system designs that require integration of processing, control and communications functions. Its industrial temperature rating and surface-mount 672-FPBGA package make it suitable for robust embedded applications where reliability and connectivity matter.

Engineers building high-performance communications equipment, industrial controllers, video processing modules or advanced embedded systems will find the LFE3-150EA-8LFN672I a flexible platform for consolidating functions, reducing BOM complexity and accelerating time to market.

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