LFE3-150EA-9FN672I

The LFE3-150EA-9FN672I is an ECP3 family FPGA from Lattice Semiconductor Corporation designed for industrial applications. It combines a large logic fabric and substantial on-chip memory with a high I/O count to support complex, configurable digital designs.

This device targets designs that require extensive programmable logic, embedded memory, and a dense I/O footprint within a compact 672-ball BGA package while operating across an industrial temperature range.

Key Features

• Core Logic  149,000 logic elements and 18,625 CLBs provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 7 Mbits of on-chip RAM (7,014,400 bits) for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Capacity  380 general-purpose I/O pins to support broad connectivity needs and interface consolidation on dense designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting  672-ball BGA package (supplier device package: 672-FPBGA, 27×27 mm) with surface-mount mounting for compact board integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control  Implement custom control logic, sensor interfacing, and real-time processing using the device's large logic capacity and industrial temperature rating.
• Embedded Systems  Integrate system functions and offload compute tasks in embedded platforms that require significant on-chip RAM and configurable logic.
• High‑Density I/O Systems  Leverage 380 I/Os to consolidate multiple interfaces and simplify board-level routing in communications or instrumentation equipment.
• Networking and Data Handling  Use the combination of logic resources and embedded memory for packet handling, buffering, or protocol bridging within constrained form factors.

Unique Advantages

• Large Logic Capacity: 149,000 logic elements and 18,625 CLBs enable implementation of substantial custom logic and parallel processing functions on a single device.
• Significant On‑Chip Memory: Approximately 7 Mbits of embedded RAM reduces external memory dependence and improves system integration density.
• Extensive I/O Count: 380 I/Os provide flexibility for multi-interface designs and high-pin-count peripheral connectivity.
• Industrial Qualification: Rated from -40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact BGA Packaging: 672-ball FPBGA (27×27 mm) package offers a high-pin-count solution in a board-friendly surface-mount footprint.

Why Choose LFE3-150EA-9FN672I?

The LFE3-150EA-9FN672I balances large programmable logic, substantial embedded memory, and a high I/O count in a compact 672-BBGA package, making it well-suited for industrial and embedded designs that require integration and configurability. Its specified operating voltage range and industrial temperature rating support robust deployment in environments with strict electrical and thermal requirements.

Designed by Lattice Semiconductor Corporation, this FPGA offers a scalable platform for engineers seeking to consolidate functions, reduce external components, and maintain flexibility for future updates through programmable logic.

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