LFE3-17EA-6FN484I

The LFE3-17EA-6FN484I is a Lattice Semiconductor ECP3 family Field Programmable Gate Array (FPGA) in a 484‑BBGA surface-mount package. It provides 17,000 logic elements, approximately 0.717 Mbits of on-chip RAM and 222 user I/Os, targeting dense, low-voltage programmable logic applications.

Built on the LatticeECP3 architecture, this device combines reconfigurable logic, dedicated DSP resources, embedded memory, and high-performance I/O capability for communications, industrial, and embedded designs that require integration and flexible interfacing.

Key Features

• Core Logic  17,000 logic elements provide substantial programmable logic capacity for mid-range system integration and control logic.
• On‑chip Memory  Total RAM bits: 716,800 (approximately 0.717 Mbits) to support buffering, FIFOs and small embedded data structures.
• DSP and sysDSP™  Includes the ECP3 family sysDSP architecture (fully cascadable slices with high-performance multiply/accumulate capability) as described for the family.
• High‑performance I/O and SERDES  222 user I/Os in the 484‑BBGA package with ECP3 family embedded SERDES support; package-level data indicates support for multiple SERDES channels in 484‑fpBGA configurations.
• Programmable sysI/O™ Buffer  I/O supports a broad range of standards listed in the family datasheet, including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL and differential standards such as LVDS and LVPECL, plus on‑chip termination and optional input equalization.
• Clocking and Timing  Family support includes PLLs and DLLs for system clocking; devices in the ECP3 family implement sysCLOCK analog PLLs and DLLs as described in the datasheet.
• Power and Packaging  Core supply: 1.14 V to 1.26 V. Surface-mount 484‑BBGA (supplier package: 484‑FPBGA, 23 × 23 mm) for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Standards and Tools  ECP3 family features include flexible configuration (SPI boot, dual-boot images), on-chip oscillator and system-level support items referenced in the family datasheet.
• Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High‑speed communications  Implement protocol bridging, packet processing or SERDES‑based interfaces where on‑chip logic, memory and serializer/deserializer resources are required.
• Embedded signal processing  Leverage sysDSP slices for multiply‑accumulate and filtering functions in real‑time processing pipelines.
• Memory and interface controllers  Use the device’s programmable I/O, DDR/DDR2/DDR3 memory support primitives and embedded RAM to build memory interface controllers and buffering logic.
• Industrial control and automation  Deploy in temperature‑sensitive industrial applications that need deterministic logic, multiple I/O standards and robust packaging.

Unique Advantages

• High integration density: 17,000 logic elements and embedded RAM reduce external components and simplify system design.
• Flexible I/O and protocol support: 222 user I/Os with family support for a wide range of single‑ended and differential interfaces enable broad interoperability.
• DSP‑oriented architecture: sysDSP slice architecture supports high-performance MAC operations for signal processing tasks.
• Compact, manufacturable package: 484‑BBGA (23 × 23 mm) surface-mount package enables compact board layouts and high-density designs.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Regulatory alignment: RoHS compliant to meet modern manufacturing and environmental requirements.

Why Choose LFE3-17EA-6FN484I?

The LFE3-17EA-6FN484I delivers a balanced combination of programmable logic, embedded memory and flexible I/O in a compact 484‑BBGA package. It is positioned for engineers who need mid-range logic capacity, DSP capability and multi‑standard I/O in an industrial‑grade FPGA platform from the Lattice ECP3 family.

This device suits designs that demand on‑chip RAM for buffering, comprehensive I/O options, and a low‑voltage core supply. Its family-level features and ecosystem support make it appropriate for communications, embedded processing and industrial control applications that prioritize integration and predictable thermal performance.

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