LFE3-17EA-6LFN484C

The LFE3-17EA-6LFN484C is a field programmable gate array (FPGA) in the Lattice ECP3 family optimized for high-performance, cost-sensitive designs. It provides a reconfigurable logic fabric with 17,000 logic elements, embedded memory and DSP resources, and high-speed I/O capability in a compact 484‑FPBGA (23 × 23 mm) package.

Targeted for commercial applications, this device delivers integration suitable for communication interfaces, DSP-accelerated processing and memory-interfacing tasks while operating on a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  Approximately 17,000 logic elements to implement control, glue logic and mid-density FPGA functions.
• Embedded Memory  Total on-chip RAM of 716,800 bits (approximately 0.7 Mbits) for buffering, FIFOs and local storage.
• DSP and Multipliers  Family-level sysDSP architecture with dedicated 18×18 multipliers; the ECP3-17 device provides 24 18×18 multipliers for high-throughput multiply-accumulate operations.
• High-Speed SERDES & I/O  Supports up to 4 SERDES channels in the 484 package and provides 222 user I/Os for parallel and serial system interfaces.
• Clocking Resources  On-device clocking with 2 PLLs and 2 DLLs to support flexible clock management and source-synchronous interfaces.
• Package & Mounting  484‑BBGA (supplier package: 484‑FPBGA, 23 × 23 mm) surface-mount package for dense board integration.
• Power & Temperature  Core supply range 1.14 V to 1.26 V; commercial-grade operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed communications  SERDES channels and abundant I/O make the device suitable for multi-protocol serial links and interface bridging.
• DSP-accelerated systems  On-chip multipliers and sysDSP resources enable hardware-accelerated signal processing, filtering and compute kernels.
• Memory interface controllers  Embedded RAM and source-synchronous I/O support buffering, DDR interfacing and read/write leveling implementations.
• Video and broadcast transport  High-speed serial support and DSP resources support transport and formatting tasks for video workflows.

Unique Advantages

• Balanced mid-range integration:  17K logic elements with substantial on-chip memory provide a good compromise between capacity and board-level complexity.
• SerDes-enabled I/O:  Up to 4 SERDES channels in the 484 package combined with 222 I/Os allow mixed parallel and serial connectivity on a single device.
• Dedicated DSP resources:  Hardware multipliers and sysDSP architecture reduce logic utilization for arithmetic-intensive functions and accelerate signal processing tasks.
• Compact packaging:  484‑FPBGA (23 × 23 mm) surface-mount footprint facilitates dense system designs while keeping a broad I/O count available.
• Commercial operating profile:  Designed for 0 °C to 85 °C operation with RoHS compliance for mainstream commercial deployments.

Why Choose LFE3-17EA-6LFN484C?

The LFE3-17EA-6LFN484C positions itself as a mid-density, commercially graded FPGA offering a balanced mix of logic, embedded memory and dedicated DSP resources with high-speed I/O capability. It is well suited for designers who need hardware acceleration, multi-protocol serial interfaces and a compact BGA package for space-constrained boards.

With family-level features such as on-chip PLL/DLL clocking and SERDES channels, this device offers scalable integration for communication, signal processing and memory-interface functions while maintaining a narrow core voltage range and standard commercial temperature rating.

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