LFE3-17EA-6FTN256C

The LFE3-17EA-6FTN256C is an ECP3 family Field Programmable Gate Array (FPGA) IC offering 17,000 logic elements and approximately 0.72 Mbits of embedded memory for mid-range programmable logic designs. Packaged in a 256-ball BGA (256-FTBGA, 17×17) and rated for commercial operation, it provides 133 user I/O pins and a low-voltage core supply range for compact, surface-mount system integration.

This FPGA targets applications that require configurable logic capacity with a balance of I/O density, on-chip RAM, and compact package options while operating within a commercial temperature range.

Key Features

• Core Logic  17,000 logic elements to implement custom digital logic, state machines, and moderate-density processing functions.
• Embedded Memory  Approximately 0.72 Mbits (716,800 bits) of on-chip RAM for buffering, lookup tables, and small data structures.
• I/O Capacity  133 general-purpose I/Os to support multiple interfaces, peripheral connections, and signal routing.
• Power  Core voltage supply range of 1.14 V to 1.26 V suitable for the device’s low-voltage FPGA core requirements.
• Package & Mounting  256-BGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for dense board-level integration.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing.

Typical Applications

• Interface Bridging and Protocol Conversion  Use the 133 I/Os and 17,000 logic elements to implement custom interface logic and protocol translation in compact systems.
• Embedded Control and Glue Logic  Deploy on-board programmable logic to consolidate discrete controllers and reduce PCB component count using available logic and RAM resources.
• Data Buffering and Signal Conditioning  Leverage approximately 0.72 Mbits of embedded memory for temporary data storage, FIFOs, and small buffering tasks in data-path designs.

Unique Advantages

• Configurable Logic Density:  17,000 logic elements provide flexible implementation capacity for a wide range of mid-density designs.
• Integrated On-Chip Memory:  Approximately 0.72 Mbits of embedded RAM reduce the need for external memory in many buffering and LUT applications.
• High I/O Count:  133 user I/Os enable multiple peripheral connections and complex interface routing without immediate reliance on external multiplexing.
• Compact, Surface-Mount Package:  256-BGA (17×17) supplier package supports high-density board layouts and reliable surface-mount assembly.
• Commercial Temperature Grade:  Rated 0 °C to 85 °C for applications designed for commercial operating environments.
• RoHS Compliant:  Meets common environmental regulations for lead-free manufacturing processes.

Why Choose LFE3-17EA-6FTN256C?

The LFE3-17EA-6FTN256C combines a practical balance of logic capacity, embedded memory, and I/O density in a compact 256-BGA package, making it well suited for mid-range programmable logic roles within commercial electronic products. Its defined voltage supply range and commercial temperature rating simplify integration into systems with standard power rails and environmental requirements.

This FPGA is a strong option for designers seeking scalable, board-level programmable logic with on-chip resources that reduce external component count while maintaining a clear specification set for procurement and system design.

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