LFE3-17EA-6LFTN256C

The LFE3-17EA-6LFTN256C is an ECP3 FPGA from Lattice Semiconductor Corporation offering a balanced combination of logic capacity, embedded memory, and I/O in a compact 256-BGA package. It targets designs requiring mid-range programmable logic integration with a commercial operating temperature range and low-voltage supply operation.

With 17,000 logic elements, approximately 0.72 Mbits of embedded memory, and 133 I/O pins, this device is suited for applications that need programmable logic, moderate on-chip RAM, and a dense BGA footprint for surface-mount assembly.

Key Features

• Logic Capacity – 17,000 logic elements and 2,125 CLBs provide substantial programmable logic resources for mid-range designs.
• Embedded Memory – Approximately 0.72 Mbits (716,800 bits) of on-chip RAM to support buffering, state storage, and small data tables.
• I/O – 133 user I/O pins to interface with peripherals, sensors, and external devices.
• Low-Voltage Core – Operates from a 1.14 V to 1.26 V supply range, enabling low-voltage system integration.
• Package & Mounting – Supplied in a 256-BGA (256-FTBGA, 17×17) package designed for surface-mount PCB assembly where board space density is important.
• Temperature & Grade – Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance – RoHS compliant for environmentally conscious designs.

Typical Applications

• Networking & Communications – Use the FPGA’s logic resources and I/O to implement protocol handling, packet processing, or interface bridging in mid-range network devices.
• Industrial Control – Implement motor control, timing logic, or custom control state machines that require embedded memory and multiple I/O signals within a commercial temperature range.
• Consumer Electronics – Integrate custom peripheral logic, user interfaces, or data buffering functions in space-constrained boards using the 256-BGA package.
• Signal Processing – Use the on-chip RAM and logic elements for real-time data buffering and custom processing pipelines in compact hardware designs.

Unique Advantages

• Balanced Logic and Memory: 17,000 logic elements paired with approximately 0.72 Mbits of embedded RAM enable a mix of combinational and stateful logic implementations without immediate need for external memory.
• Generous I/O Count: 133 I/O pins provide flexibility to connect multiple peripherals and buses directly to the FPGA.
• Compact, High-Density Package: 256-FTBGA (17×17) delivers a small PCB footprint for designs where board space is limited.
• Low-Voltage Operation: 1.14 V to 1.26 V supply compatibility supports integration into low-voltage system architectures.
• RoHS Compliant: Environmentally compliant manufacturing reduces regulatory complexity for global product distribution.

Why Choose LFE3-17EA-6LFTN256C?

The LFE3-17EA-6LFTN256C positions itself as a mid-range, commercial-grade FPGA that delivers a practical mix of logic density, embedded memory, and I/O in a compact BGA package. It is appropriate for engineers and product teams who need on-board programmable logic for protocol implementation, control logic, or data buffering without stepping up to larger device families.

Manufactured by Lattice Semiconductor Corporation, this FPGA is a suitable choice for designs that prioritize a balance of integration, board space efficiency, and standard commercial temperature operation, while remaining compliant with RoHS requirements.

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