LFE3-17EA-6LMG328I

The LFE3-17EA-6LMG328I is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 328-LFBGA (328-CSBGA, 10 × 10 mm) package. It delivers a balance of programmable logic, embedded memory and serial I/O capability targeted for low-power, industrial-grade applications.

Built on the LatticeECP3 architecture, this device combines approximately 17,000 logic elements with embedded RAM, DSP resources and high-speed serial features to support connectivity, signal processing and system integration tasks in space-constrained boards and industrial environments.

Key Features

• Logic Density  Approximately 17,000 logic elements (17K LUTs) suitable for mid-range programmable logic implementations.
• Embedded Memory  Approximately 0.717 Mbits (716,800 bits) of on-chip RAM for packet buffering, state machines and small data stores.
• DSP Resources  Family sysDSP architecture provides multiply/accumulate capability and dedicated 18×18 multipliers (ECP3-17 device level supports 24 multipliers) for embedded signal processing tasks.
• Embedded SERDES  ECP3 family supports embedded SERDES; the 328 csBGA package for the ECP3-17 maps to 2 SERDES channels and 116 user I/Os, enabling high-speed serial interfaces where required.
• Programmable I/O  Up to 116 user I/Os with support for a wide range of I/O standards (as provided by the ECP3 family); flexible I/O helps adapt the device to varied peripheral and memory interfaces.
• Clocking and Timing  Family-level support for PLLs and DLLs (ECP3-17 includes 2 PLLs and 2 DLLs) to manage clock domains and timing for complex designs.
• Power Supply  Core voltage range specified at 1.14 V to 1.26 V, enabling predictable power design and supply selection.
• Package & Mounting  328-LFBGA (CSBGA) surface-mount package, 10 × 10 mm footprint for compact board designs.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for industrial operating environments.
• RoHS Compliant  Device meets RoHS requirements for lead-free manufacturing and assembly.

Typical Applications

• High-speed serial connectivity  Use the embedded SERDES channels and flexible I/O to implement interfaces such as gigabit links and protocol bridging in communication equipment.
• Embedded signal processing  Leverage the sysDSP architecture and 18×18 multipliers for DSP tasks including filtering, accumulation and arithmetic-intensive functions.
• Memory and interface controllers  On-chip RAM and source-synchronous I/O support from the ECP3 family make the device suitable for controller roles, buffering and timing-critical interfaces.
• Industrial control and instrumentation  Industrial temperature rating and compact 10 × 10 mm package enable deployment in factory automation, test equipment and instrumentation systems.

Unique Advantages

• Balanced mid-range integration: Approximately 17K logic elements with embedded RAM provide a compact platform for moderate-complexity systems without excessive board-level components.
• On-chip DSP and multiplier support: Dedicated multiplier resources and sysDSP architecture reduce the need for external DSP ASICs for many signal-processing functions.
• Small, surface-mount footprint: 328-CSBGA (10 × 10 mm) package supports space-constrained designs while maintaining up to 116 user I/Os.
• Industrial temperature range: Rated –40 °C to 100 °C for reliable operation in challenging ambient conditions.
• Predictable power envelope: Defined core supply range (1.14 V–1.26 V) simplifies power-supply design and thermal planning.
• Environmentally compliant: RoHS compliance supports modern manufacturing requirements.

Why Choose LFE3-17EA-6LMG328I?

The LFE3-17EA-6LMG328I positions itself as a practical, industrial-grade mid-range FPGA option that combines roughly 17,000 logic elements, embedded memory and dedicated DSP and SERDES capabilities in a compact 328-LFBGA package. It is well suited to designers who need a balance of programmable logic, on-chip RAM and serial I/O channels for connectivity, processing and control functions in industrial and space-constrained systems.

Backed by the ECP3 family architecture, this device offers design scalability through documented family features such as programmable I/O standards, clocking resources and embedded DSP primitives—providing a platform that supports both prototyping and volume deployment with predictable electrical and thermal characteristics.

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