LFE3-17EA-6MG328I

The LFE3-17EA-6MG328I is a field programmable gate array (FPGA) from the Lattice ECP3 family, built on reconfigurable SRAM logic. It delivers a mid-range logic density with 17,000 logic elements and integrated resources targeted at high-volume, high-speed, cost-sensitive designs.

Designed for applications that require embedded DSP, SERDES connectivity and compact packaging, this device combines on-chip memory, DSP multipliers and configurable I/O in a 328-LFBGA (328-CSBGA 10 × 10 mm) surface-mount package.

Key Features

• Logic Capacity 17,000 logic elements for mid-range system integration and complex glue-logic or control functions.
• Embedded Memory Approximately 0.7 Mbits of embedded memory (716,800 total RAM bits) to support on-chip buffering and state storage.
• High-speed SERDES Embedded SERDES capability with up to 2 channels supported in the 328-CSBGA package, enabling high-speed serial links.
• sysDSP and Multipliers Dedicated DSP resources including 18 × 18 multipliers (24 available on this device) for efficient multiply-accumulate and signal-processing tasks.
• Programmable sysI/O 116 user I/Os with a programmable I/O buffer structure and pre-engineered source-synchronous support for a wide range of interface standards.
• Clocking and Timing On-chip timing resources including PLLs and DLLs (two PLLs and two DLLs available on ECP3-17 devices) for precise clock management.
• Flexible Configuration Support for SPI boot flash interface, dual-boot images, slave SPI and field-update TransFR I/O options described in the family data sheet.
• Industrial Temperature Range & Power Industrial-grade device rated for operation from −40 °C to 100 °C with a core supply range of 1.14 V to 1.26 V.
• Package and Mounting 328-LFBGA (328-CSBGA, 10 × 10 mm) surface-mount package optimized for compact boards and high-density layouts.
• Standards & System Support Family-level support features referenced in the data sheet include system utilities (e.g., Reveal Logic Analyzer, ORCAstra configuration utility), soft error detect macros, and on-chip oscillator functionality.

Typical Applications

• High‑speed Serial Interfaces Implements SERDES-based links such as PCI Express, Ethernet and other serial protocols where compact, integrated serial I/O is required.
• DSP and Signal Processing Uses sysDSP resources and 18×18 multipliers for filtering, FFTs, and other real-time signal-processing functions.
• Memory Interface and Buffering Leverages embedded RAM and source-synchronous I/O to implement DDR/DDR2/DDR3 interface logic and on-chip buffering.
• Video and Media Transport Supports protocol and transport blocks for video standards including SMPTE 3G and other media link requirements via SERDES and programmable I/O.

Unique Advantages

• Balanced mid-range integration: 17K logic elements, embedded memory and DSP multipliers provide a compact platform for mixed-control and signal-processing designs.
• Compact package with ample I/O: 328-CSBGA (10 × 10 mm) delivers 116 I/Os in a small footprint suitable for space-constrained PCBs.
• Deterministic timing resources: Two PLLs and two DLLs enable robust clocking options for multi-rate and source-synchronous interfaces.
• Industrial operating range: Rated for −40 °C to 100 °C, supporting deployment in industrial environments that require extended temperature operation.
• Flexible configuration and system tools: Family-level support for SPI boot, dual-boot images and design utilities aids development, field updates and system integration.
• RoHS compliant: Environmentally compliant for modern manufacturing requirements.

Why Choose LFE3-17EA-6MG328I?

The LFE3-17EA-6MG328I targets designers who need a balanced FPGA platform offering mid-range logic density, on-chip memory and DSP resources combined with SERDES and flexible I/O in a compact industrial-grade package. Its combination of 17,000 logic elements, approximately 0.7 Mbits of embedded memory, 24 18×18 multipliers and 116 I/Os makes it suitable for a wide range of communications, media transport and signal-processing applications.

Backed by ECP3 family system features such as configurable I/O, PLL/DLL clocking, configuration utilities and on-chip system support, this device can reduce board-level complexity while providing the programmable flexibility needed for evolving product requirements.

If you would like pricing, availability or to request a quote for LFE3-17EA-6MG328I, submit a sales inquiry or request a formal quote to begin the procurement process.