LFE3-17EA-7FN484C

The LFE3-17EA-7FN484C is an ECP3-series Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It provides approximately 17,000 logic elements and roughly 0.72 Mbits of embedded memory, with 222 user I/O pins for moderate to high connectivity in commercial designs.

Designed for commercial-grade embedded applications, this device combines mid-range logic capacity, on-chip RAM, and a compact 484-BBGA surface-mount package. The device operates from a core voltage range of 1.14 V to 1.26 V and is specified for 0 °C to 85 °C operation.

Key Features

• Logic Capacity — Approximately 17,000 logic elements to implement custom digital functions and moderate-density logic designs.
• Embedded Memory — Approximately 0.72 Mbits of on-chip RAM suitable for buffering, small lookup tables, and state storage.
• I/O Resources — 222 user I/O pins to support multiple interfaces and moderate signal routing requirements.
• Power — Core supply range from 1.14 V to 1.26 V, enabling operation within a defined low-voltage window for the FPGA fabric.
• Package and Mounting — 484-ball BGA (484-FPBGA, 23×23) in a surface-mount package, enabling compact board integration and high pin density.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Commercial Embedded Systems — Provides mid-range programmable logic and embedded memory for commercial electronics requiring configurable logic and I/O.
• High-density I/O Modules — 222 I/O pins support designs that need multiple external interfaces or dense signal routing.
• Compact Surface-mount Designs — 484-BBGA package supports space-constrained PCBs where high pin count and a small footprint are required.

Unique Advantages

• Balanced Logic and Memory: Approximately 17,000 logic elements paired with ~0.72 Mbits of on-chip RAM gives designers a practical balance for many commercial FPGA tasks.
• High I/O Count in a Compact Package: 222 I/O pins in a 484-BBGA (23×23) surface-mount package enable dense connectivity without a large board area.
• Defined Power Envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply design and component selection for the FPGA fabric.
• Commercial-grade Operation: Specified for 0 °C to 85 °C operation, matching typical commercial electronics thermal requirements.
• RoHS Compliant: Meets RoHS requirements for material compliance in commercial electronic products.

Why Choose LFE3-17EA-7FN484C?

The LFE3-17EA-7FN484C delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 484-BBGA surface-mount package. Its electrical and thermal specifications make it suitable for a wide range of commercial embedded projects where configurable logic, moderate on-chip RAM, and high pin count are required.

For design teams seeking a commercially graded FPGA with clear supply and thermal requirements, this ECP3 device offers a straightforward, verifiable specification set that supports integration into space-constrained PCBs and multi-interface designs.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the LFE3-17EA-7FN484C.