LFE3-17EA-7FTN256I

IC FPGA 133 I/O 256FTBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 133 716800 17000 256-BGA

Quantity 1,019 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O133Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits716800

Overview of LFE3-17EA-7FTN256I – ECP3 FPGA, 17K logic elements, 256-FTBGA

The LFE3-17EA-7FTN256I is a LatticeECP3 family field programmable gate array (FPGA) supplied in a 256-FTBGA (17 × 17 mm) package. It provides 17,000 logic elements, 133 user I/Os and family-level features such as embedded SERDES, sysDSP slices and flexible memory resources, making it suitable for industrial embedded and communications applications that require moderate logic density and integrated I/O capabilities.

Key Features

  • Core Logic — 17,000 logic elements (LEs) for implementing combinational and sequential logic.
  • Memory — Approximately 0.7 Mbits of embedded block RAM (716,800 bits total) plus distributed RAM resources for buffering, FIFOs and on-chip storage.
  • DSP Resources — Enhanced sysDSP architecture with dedicated multipliers; device-level configuration indicates support for 24 × 18×18 multipliers for high-performance multiply/accumulate operations.
  • Embedded SERDES — Family SERDES support from 150 Mbps to 3.2 Gbps and 256-FTBGA package configuration provides 4 SERDES channels alongside 133 I/Os for high-speed serial links.
  • Clocking and Timing — On-chip clock management including DLLs and PLLs (2 DLLs and up to 2 PLLs for this device selection) to support phase and frequency control for system timing.
  • I/O and Interfaces — 133 user I/Os in the 256-FTBGA package with programmable I/O buffer options and source-synchronous support for a variety of parallel and serial interfaces.
  • Power — Core supply range specified at 1.14 V to 1.26 V to match system power-rail requirements.
  • Package & Environmental — 256-ball FTBGA (17 × 17 mm) package; industrial grade with operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Configuration & System Support — Family-level configuration features include SPI boot flash interface, dual-boot images and on-chip oscillator for initialization and general use.

Typical Applications

  • Industrial Control — Implement motion control, protocol bridging and deterministic I/O processing using the device’s logic elements, DSP resources and industrial temperature range.
  • Communications & Networking — Support medium-speed serial links and protocol interfaces with built-in SERDES channels and flexible I/O standards.
  • Signal Processing — Use sysDSP slices and dedicated multipliers for filtering, accumulation and other real-time signal processing tasks.
  • Embedded System Glue Logic — Integrate peripheral interfaces, custom control logic and memory buffering to reduce BOM and board-level complexity.

Unique Advantages

  • Balanced Logic Density: 17,000 logic elements provide a mid-range capacity that fits compact but feature-rich embedded designs without overspecifying resources.
  • Integrated High-Speed I/O: 133 user I/Os with the 256-FTBGA package and family SERDES support enable both parallel and serial interfacing from a single device.
  • On-chip DSP Acceleration: Dedicated multipliers and sysDSP architecture accelerate math-intensive workloads and offload processing from the host MCU or CPU.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C, suitable for a wide range of industrial environments and deployment scenarios.
  • Flexible Boot & Configuration: SPI boot flash, dual-boot image support and on-chip oscillator simplify system bring-up and field updates.
  • Compact, Manufacturable Package: 256-FTBGA (17 × 17 mm) package balances board area and I/O accessibility for production designs.

Why Choose LFE3-17EA-7FTN256I?

The LFE3-17EA-7FTN256I delivers a practical mix of logic capacity, embedded memory and I/O flexibility for industrial and communications-focused embedded systems. Its combination of approximately 0.7 Mbits of embedded RAM, 17,000 logic elements, dedicated DSP multipliers and multi-channel SERDES in a compact 256-FTBGA package makes it a strong choice for designs that need mid-range programmable logic with integrated high-speed interfaces.

As a member of the LatticeECP3 family, this device inherits family-level configuration and system features that ease integration and field updates, while the specified operating voltage and industrial temperature rating support robust deployment in demanding environments.

Request a quote or contact sales to discuss availability, pricing and volume options for the LFE3-17EA-7FTN256I.

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