LFE3-17EA-7FTN256I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 716800 17000 256-BGA |
|---|---|
| Quantity | 1,019 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 716800 |
Overview of LFE3-17EA-7FTN256I – ECP3 FPGA, 17K logic elements, 256-FTBGA
The LFE3-17EA-7FTN256I is a LatticeECP3 family field programmable gate array (FPGA) supplied in a 256-FTBGA (17 × 17 mm) package. It provides 17,000 logic elements, 133 user I/Os and family-level features such as embedded SERDES, sysDSP slices and flexible memory resources, making it suitable for industrial embedded and communications applications that require moderate logic density and integrated I/O capabilities.
Key Features
- Core Logic — 17,000 logic elements (LEs) for implementing combinational and sequential logic.
- Memory — Approximately 0.7 Mbits of embedded block RAM (716,800 bits total) plus distributed RAM resources for buffering, FIFOs and on-chip storage.
- DSP Resources — Enhanced sysDSP architecture with dedicated multipliers; device-level configuration indicates support for 24 × 18×18 multipliers for high-performance multiply/accumulate operations.
- Embedded SERDES — Family SERDES support from 150 Mbps to 3.2 Gbps and 256-FTBGA package configuration provides 4 SERDES channels alongside 133 I/Os for high-speed serial links.
- Clocking and Timing — On-chip clock management including DLLs and PLLs (2 DLLs and up to 2 PLLs for this device selection) to support phase and frequency control for system timing.
- I/O and Interfaces — 133 user I/Os in the 256-FTBGA package with programmable I/O buffer options and source-synchronous support for a variety of parallel and serial interfaces.
- Power — Core supply range specified at 1.14 V to 1.26 V to match system power-rail requirements.
- Package & Environmental — 256-ball FTBGA (17 × 17 mm) package; industrial grade with operating temperature range of −40 °C to 100 °C and RoHS compliance.
- Configuration & System Support — Family-level configuration features include SPI boot flash interface, dual-boot images and on-chip oscillator for initialization and general use.
Typical Applications
- Industrial Control — Implement motion control, protocol bridging and deterministic I/O processing using the device’s logic elements, DSP resources and industrial temperature range.
- Communications & Networking — Support medium-speed serial links and protocol interfaces with built-in SERDES channels and flexible I/O standards.
- Signal Processing — Use sysDSP slices and dedicated multipliers for filtering, accumulation and other real-time signal processing tasks.
- Embedded System Glue Logic — Integrate peripheral interfaces, custom control logic and memory buffering to reduce BOM and board-level complexity.
Unique Advantages
- Balanced Logic Density: 17,000 logic elements provide a mid-range capacity that fits compact but feature-rich embedded designs without overspecifying resources.
- Integrated High-Speed I/O: 133 user I/Os with the 256-FTBGA package and family SERDES support enable both parallel and serial interfacing from a single device.
- On-chip DSP Acceleration: Dedicated multipliers and sysDSP architecture accelerate math-intensive workloads and offload processing from the host MCU or CPU.
- Industrial Temperature Range: Rated for −40 °C to 100 °C, suitable for a wide range of industrial environments and deployment scenarios.
- Flexible Boot & Configuration: SPI boot flash, dual-boot image support and on-chip oscillator simplify system bring-up and field updates.
- Compact, Manufacturable Package: 256-FTBGA (17 × 17 mm) package balances board area and I/O accessibility for production designs.
Why Choose LFE3-17EA-7FTN256I?
The LFE3-17EA-7FTN256I delivers a practical mix of logic capacity, embedded memory and I/O flexibility for industrial and communications-focused embedded systems. Its combination of approximately 0.7 Mbits of embedded RAM, 17,000 logic elements, dedicated DSP multipliers and multi-channel SERDES in a compact 256-FTBGA package makes it a strong choice for designs that need mid-range programmable logic with integrated high-speed interfaces.
As a member of the LatticeECP3 family, this device inherits family-level configuration and system features that ease integration and field updates, while the specified operating voltage and industrial temperature rating support robust deployment in demanding environments.
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