LFE3-17EA-7LFN484C

The LFE3-17EA-7LFN484C is a Lattice Semiconductor ECP3-series FPGA offering 17,000 logic elements, approximately 0.72 Mbits of embedded RAM and 222 user I/Os in a 484‑ball BGA (23 × 23 mm) surface-mount package. It combines mid-range logic density with the ECP3 family feature set, including embedded SERDES, sysDSP slices and flexible memory and I/O resources.

Designed for commercial‑grade applications (0 °C to 85 °C), this device is targeted at high-volume, high-speed and cost-sensitive designs that require on‑chip DSP capability, multi-protocol serial links and broad I/O support.

Key Features

• Core Density — 17,000 logic elements provide sufficient capacity for mid-range FPGA designs and integration of control, interface and processing logic.
• Embedded Memory — Approximately 0.72 Mbits of on‑chip RAM (716,800 total RAM bits) for buffers, FIFOs and local storage.
• sysDSP and Multipliers — ECP3 family sysDSP architecture (family-level feature) supports cascaded DSP slices and multi-precision multiply/accumulate operations for signal processing tasks.
• Embedded SERDES — Family support for high-speed SERDES up to 3.2 Gbps; the 484‑ball FPBGA package provides 4 SERDES channels alongside the 222 user I/Os.
• Flexible I/O Standards — 222 user I/Os with programmable sysI/O buffer options and source‑synchronous I/O support for DDR interfaces and a wide range of single‑ended and differential standards (family features).
• Configuration and System Support — Flexible device configuration options included at the family level such as SPI boot flash interface, dual‑boot capability, TransFR I/O for field updates and on‑chip oscillator for initialization.
• Power and Packaging — Core supply operable in the 1.14 V to 1.26 V range; supplied in a 484‑ball FPBGA (23 × 23 mm) surface‑mount package for compact board integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial electronics and embedded applications.
• Regulatory Compliance — RoHS‑compliant.

Typical Applications

• High‑speed communications — Use embedded SERDES channels and abundant I/Os for protocol bridging and link interfaces such as PCI Express, Ethernet, SONET/SDH, CPRI, SMPTE 3G and Serial RapidIO (family-level support).
• Signal processing and DSP — sysDSP slices and on‑chip multipliers enable local filtering, aggregation and compute tasks in video, audio and sensor applications.
• Embedded control and interface — 17,000 logic elements and 222 I/Os allow consolidation of control logic, peripheral interfaces and glue logic in compact embedded systems.
• Memory and bus interfacing — Source‑synchronous I/O and dedicated memory support (family-level) for DDR/DDR2/DDR3 memory interfaces and high‑throughput buffering.

Unique Advantages

• Balanced mid‑range density: 17,000 logic elements deliver a compromise of capacity and cost for designs that need more than small CPLDs but less than high‑end FPGAs.
• Integrated DSP capability: sysDSP architecture and on‑chip multipliers reduce external DSP IC count and simplify signal processing implementations.
• High‑speed serial connectivity: Built‑in SERDES with multi‑Gbps capability in the 484‑ball package enables protocol support for modern communications links.
• Compact, board‑ready package: 484‑ball FPBGA (23 × 23 mm) surface‑mount packaging supports high pin‑count designs in a relatively small footprint.
• Flexible configuration options: SPI boot, dual‑boot and field update features give designers options for secure and maintainable system deployment (family-level capabilities).
• Commercial temperature and RoHS compliant: Suitable for mainstream commercial deployments with regulatory compliance for lead‑free assemblies.

Why Choose LFE3-17EA-7LFN484C?

LFE3-17EA-7LFN484C positions itself as a mid‑range FPGA solution within the Lattice ECP3 family, offering a balance of logic capacity, embedded memory and I/O count for designers targeting commercial applications. Its combination of 17,000 logic elements, approximately 0.72 Mbits of embedded RAM and 222 I/Os in a 484‑ball FPBGA package makes it well suited for communications interfaces, embedded signal processing and complex peripheral integration.

Choosing this device gives access to the broader ECP3 family feature set—SERDES, sysDSP, flexible I/O standards and configuration options—providing scalability and ecosystem support that help reduce BOM complexity and accelerate system development and deployment.

Request a quote or submit an inquiry to evaluate LFE3-17EA-7LFN484C for your next design and get pricing, availability and support details.