LFE3-17EA-7LFTN256I

IC FPGA 133 I/O 256FTBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 133 716800 17000 256-BGA

Quantity 1,140 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O133Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits716800

Overview of LFE3-17EA-7LFTN256I – ECP3 Field Programmable Gate Array (FPGA) IC 133 I/Os, 17K Logic Elements, 256-BGA

The LFE3-17EA-7LFTN256I is an industrial-grade FPGA from the Lattice ECP3 family designed for mid-density, high-performance embedded designs. It delivers 17,000 logic elements, integrated DSP resources, SERDES channels in the 256-FTBGA package, and flexible on-chip memory ideal for communications, signal processing, and industrial control applications.

Built for system integration and deterministic operation across a wide temperature range, this device combines programmable logic, embedded memory and I/O flexibility with proven configuration and debugging tools from the ECP3 family.

Key Features

  • Core Capacity — 17,000 logic elements for mid-density logic integration and complex control functions.
  • Embedded Memory — Approximately 0.7 Mbits of on-chip embedded memory (716,800 bits) for buffering, FIFOs and local data storage.
  • DSP Resources — Device-class DSP support with 24 18×18 multipliers for multiply-accumulate and signal-processing tasks.
  • SERDES and High‑Speed Links — Package-level support for up to 4 SERDES channels in the 256-FTBGA configuration for serial protocols and high-speed I/O.
  • Programmable I/O — 133 user I/Os with programmable buffer support and a wide range of interface standards supported at the family level.
  • Clocking — Integrated PLLs and DLLs (family-level support; ECP3-17 devices provide 2 PLLs and 2 DLLs) to support system timing and high-speed interfaces.
  • Power — Core supply operating range from 1.14 V to 1.26 V to match system power rails and ensure stable core operation.
  • Package & Mounting — 256-FTBGA (17 × 17 mm) surface-mount package suitable for compact board layouts.
  • Industrial Grade Reliability — Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial applications.
  • Configuration & Tooling — ECP3 family-level configuration options including SPI boot flash interface, dual-boot images and on-chip configuration utility support for in-system updates and debugging.

Typical Applications

  • High-Speed Communications — Implement protocol bridging and packet processing using SERDES channels and flexible I/O for Ethernet, PCIe and other serial links documented at the family level.
  • Video and Broadcast — Support SMPTE and high-speed serial video interfaces using the device’s SERDES and DSP resources for processing pipelines.
  • Industrial Control — Deterministic logic, DSP blocks and extended temperature range make this device suitable for motor control, machine automation and industrial protocol handling.
  • Data Acquisition & Conversion — Interface high-speed ADC/DAC devices and implement local data aggregation and preprocessing with on-chip memory and DSP multipliers.

Unique Advantages

  • Highly Integrated Mid‑Density FPGA: 17,000 logic elements and on-chip memory reduce external components while consolidating control and processing functions.
  • Built for High‑Speed I/O: 133 user I/Os and package-level SERDES support enable a variety of serial and parallel interface topologies.
  • DSP‑Capable Fabric: Dedicated 18×18 multipliers accelerate filtering, transforms and other math-intensive operations without offloading to an external DSP.
  • Industrial Reliability: Rated operation from −40 °C to 100 °C and RoHS compliance meet industrial deployment requirements.
  • Flexible Configuration: SPI boot flash support and dual-boot image capability provide field update flexibility and robust configuration options.
  • Compact Package: 256-FTBGA (17 × 17 mm) offers a balance of I/O density and PCB footprint for space-constrained designs.

Why Choose LFE3-17EA-7LFTN256I?

This ECP3-series FPGA part offers a balanced combination of logic capacity, DSP resources and high-speed I/O in a compact industrial-grade package. It is well suited to engineers building mid-density embedded systems that require integrated memory, deterministic operation across extended temperatures, and support for serial communication protocols documented at the family level.

Choosing this device provides a scalable path within the ECP3 family, access to family configuration and debug utilities, and a component that aligns with industrial system requirements for reliability and integration.

Request a quote or submit an inquiry for pricing and availability to begin integrating the LFE3-17EA-7LFTN256I into your next design.

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