LFE3-17EA-7MG328I

The LFE3-17EA-7MG328I is a Field Programmable Gate Array (FPGA) from the LatticeECP3 family, featuring a reconfigurable SRAM-based fabric optimized for high-integration, cost-sensitive designs. This device provides 17,000 logic elements, approximately 0.7 Mbits of embedded memory, and 116 user I/Os in a compact 328-CSBGA (10 × 10 mm) package.

Targeted for industrial-grade applications, the device combines DSP resources, SERDES channels, and flexible I/O standards to support high-performance serial interfaces and system-level integration while operating across a wide voltage and temperature range.

Key Features

• Core Logic 
  17,000 logic elements (LUT-based fabric) suitable for medium-density integration and complex control logic.
• Embedded Memory 
  Approximately 0.7 Mbits of embedded block RAM (sysMEM/EBR) plus distributed RAM for buffering, packet processing, and state storage.
• DSP Resources (sysDSP) 
  Dedicated DSP architecture with 18×18 multipliers—24 18×18 multipliers available on the ECP3-17 device—for efficient multiply-accumulate operations and signal processing tasks.
• High-Speed Serial and Parallel I/O 
  Package supports 116 I/Os and includes 2 SERDES channels in the 328-CSBGA package; family-level SERDES support spans a wide range of serial protocols and data rates.
• Flexible I/O Standards 
  Programmable I/O buffer supports a broad set of interfaces including LVTTL, LVCMOS, SSTL, HSTL, LVDS, Bus-LVDS, LVPECL and others as defined by the LatticeECP3 family.
• Power and Supply 
  Core supply voltage range: 1.14 V to 1.26 V.
• Package and Mounting 
  328-LFBGA / 328-CSBGA (10 × 10 mm) surface-mount package optimized for compact system designs.
• Industrial Temperature Range 
  Rated for operation from −40 °C to 100 °C.
• RoHS Compliant 
  Device is RoHS compliant.
• System and Configuration Support 
  Family-level support for features such as dual-boot images, SPI boot flash interface, built-in oscillator, on-chip configuration options and the Reveal logic analysis and ORCAstra configuration utilities.

Typical Applications

• Industrial Control 
  Leverage the industrial temperature rating and flexible I/O to implement motor control, PLC interfaces, and factory automation logic.
• Communications and Networking 
  Use the embedded SERDES channels and flexible I/O standards to implement medium-speed serial links, protocol bridging, and packet processing functions.
• Video and Broadcast Interfaces 
  DSP resources and high-speed I/O make the device suitable for video data handling, timing alignment, and interface adaptation in broadcast systems.
• Embedded System Integration 
  Deploy as a programmable glue-logic and peripheral controller to consolidate multiple interfaces and reduce board-level component count.

Unique Advantages

• Balanced Integration: Combines 17,000 logic elements with embedded RAM and DSP multipliers to support mixed logic and signal-processing functions in a single device, reducing BOM and board complexity.
• Compact, High‑I/O Package: The 328-CSBGA (10 × 10 mm) delivers 116 I/Os and 2 SERDES channels in a small footprint, enabling dense system designs.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied as an industrial-grade component for extended temperature environments.
• Flexible Interface Support: Programmable sysI/O buffer and family-level support for a broad range of I/O standards simplify integration with diverse peripherals and memory types.
• Configuration and Debug Ecosystem: Built-in configuration features plus family tools (Reveal logic analyzer and ORCAstra configuration utility) help shorten development and debug cycles.

Why Choose LFE3-17EA-7MG328I?

The LFE3-17EA-7MG328I positions itself as a compact, industrial-grade FPGA option for designs that require a balance of logic capacity, embedded memory, DSP capabilities, and flexible I/O. Its combination of 17,000 logic elements, approximately 0.7 Mbits of embedded RAM, 24 18×18 multipliers, and a 116‑I/O 328‑CSBGA package make it a practical choice for mid-density, performance-conscious embedded systems.

Designed for applications that demand reliable operation across a wide temperature range and a compact PCB footprint, this device is suitable for system integrators and engineers looking to consolidate interfaces, implement serial links, and accelerate signal-processing tasks while leveraging the LatticeECP3 family’s configuration and debug features.

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