LFE3-17EA-8FTN256I

The LFE3-17EA-8FTN256I is an industrial-grade FPGA from the LatticeECP3 family, delivered in a 256-FTBGA (17×17 mm) surface-mount package. It integrates programmable logic, on-chip memory, DSP resources and high-speed I/O to support mid-density, high-performance embedded designs.

Designed for high-volume, high-speed, low-cost applications, this device combines 17,000 logic elements with approximately 0.72 Mbits of embedded memory and 133 user I/Os, offering a compact, power-efficient platform for telecom, networking, video and industrial systems.

Key Features

• Core Logic: 17,000 logic elements providing configurable LUT-based logic for mid-density system integration.
• Memory: Total on-chip RAM of 716,800 bits — approximately 0.72 Mbits of embedded memory for frame buffers, FIFOs and control storage.
• DSP Resources: Part of the ECP3 family architecture that includes sysDSP slice-based multiply/accumulate resources and 18×18 multipliers (ECP3-17 family allocation: 24 multipliers), enabling efficient signal processing.
• High-speed Serial & Source-Synchronous I/O: Family-level embedded SERDES and pre-engineered source-synchronous interfaces; this package supports up to 4 SERDES channels paired with 133 I/Os for common serial protocols and high-speed data paths.
• Programmable I/O Standards: Flexible sysI/O buffer options and on-chip termination support a broad range of I/O standards for interfacing with ADCs, DACs memory and external peripherals (as specified for the ECP3 family).
• Clocking & Timing: Family features include multiple PLLs and DLLs for system clocking and clock-domain management.
• Power Supply: Core voltage supply range 1.14 V to 1.26 V (nominal 1.2 V core), enabling low-voltage operation.
• Package & Mounting: 256-FTBGA (17×17 mm) package, surface-mount mounting for compact board designs.
• Industrial Temperature Range: Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory: RoHS compliant.

Typical Applications

• Networking & Telecom: Use the device’s SERDES channels and flexible I/O to implement packet processing, line interfaces and protocol bridging in communication equipment.
• Broadcast & Video Processing: Leverage on-chip memory and DSP slices for video frame buffering, format conversion and high-speed serial transport in broadcast or streaming systems.
• Industrial Control & Automation: Industrial temperature rating and a rich mix of I/O make this FPGA suitable for motor control, sensor aggregation and deterministic interface logic in automated systems.
• Embedded Systems & Appliances: Compact 256-BGA packaging and mid-range logic density support consumer and industrial embedded designs that require integrated logic, memory and high-speed interfaces.

Unique Advantages

• Balanced Integration: 17,000 logic elements combined with approximately 0.72 Mbits of embedded memory reduces the need for external components and simplifies board-level design.
• Mid-Density DSP Capability: Family DSP architecture and dedicated 18×18 multipliers provide efficient multiply/accumulate performance for signal processing tasks without large-area devices.
• Flexible High-Speed I/O: Up to 4 SERDES channels in the 256-FTBGA package and a wide set of programmable I/O standards enable diverse interface options for modern systems.
• Industrial Reliability: Rated for −40 °C to 100 °C and supplied in a robust BGA package for long-term operation in industrial environments.
• Low-Voltage Core: Operates with a nominal 1.2 V core supply (1.14–1.26 V range) to support efficient power profiles in embedded applications.
• Standards and Tools Compatibility: As part of the LatticeECP3 family, the device benefits from family-level features such as PLL/DLL clocking, configuration options and development ecosystem support.

Why Choose LFE3-17EA-8FTN256I?

The LFE3-17EA-8FTN256I delivers a practical balance of logic density, embedded memory and DSP capability in a compact 256-FTBGA package, making it well suited for designers targeting mid-range, high-speed embedded systems. Its combination of 17,000 logic elements, approximately 0.72 Mbits of on-chip RAM, 133 I/Os and industrial temperature rating provides a versatile building block for networking, video, industrial control and embedded applications.

As a member of the LatticeECP3 family, this device offers a clear upgrade path within a standardized architecture and leverages family-level features for clocking, SERDES and I/O flexibility—helping reduce design risk and accelerate time-to-market.

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