LFE3-17EA-8LFN484C

The LFE3-17EA-8LFN484C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 484-BBGA package. It provides a balanced combination of logic density, embedded memory and high-speed I/O capability for high-volume, high-speed, low-cost applications.

Built on the LatticeECP3 architecture, this commercial-grade device integrates approximately 0.72 Mbits of on-chip RAM, 17,000 logic elements, and 222 user I/Os in a 23 × 23 mm 484-FPBGA footprint, with a core supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 17,000 logic elements providing the programmable fabric for control, glue logic and custom datapath implementations.
• Memory Approximately 0.72 Mbits of total on-chip RAM for embedded storage and buffering.
• sysDSP and Multipliers Enhanced DSP slice architecture with support for optimized multiply and accumulate operations; device-class resources include 24 18×18 multipliers (ECP3-17 class).
• Embedded SERDES & High-Speed I/O Integrated SERDES channels and up to 222 user I/Os in the 484-FPBGA package enable high-speed serial and parallel interfaces; package-level SERDES provision aligns with ECP3 family listings.
• Programmable I/O Standards Programmable sysI/O buffer support for a broad range of parallel and differential I/O standards (as defined by the ECP3 family), enabling flexible interfacing to external devices.
• Clocking Multiple PLLs and DLLs are supported across the ECP3 family to simplify clock management and timing closure in complex designs.
• Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor suitable for compact board layouts.
• Power & Temperature Core supply 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance RoHS-compliant.

Typical Applications

• Networking & Telecom Equipment Leverages integrated SERDES and high I/O count for protocol bridging, packet processing front-ends and interface adaptation.
• High-Performance Embedded Systems Uses the logic fabric, on-chip RAM and DSP slices for embedded control, custom accelerators and real-time data handling.
• Signal Processing & Data Acquisition Employs sysDSP resources and multipliers for filtering, FFTs and other numeric-intensive tasks in video, audio or measurement systems.
• Interface & Bridge Functions Provides a flexible platform for implementing protocol converters, memory controllers or multi-standard I/O interfaces.

Unique Advantages

• High integration in a compact package: 222 I/Os and 17,000 logic elements in a 23 × 23 mm 484-FPBGA reduce board area and simplify routing.
• Embedded memory for buffering: Approximately 0.72 Mbits of on-chip RAM supports local data storage and reduces dependence on external memory for many designs.
• DSP-capable fabric: Dedicated multiply resources and sysDSP architecture accelerate multiply-accumulate workloads and numeric processing.
• Flexible I/O and SERDES support: Programmable sysI/O and integrated SERDES enable a wide range of serial and parallel interfaces to connect with peripherals and high-speed links.
• Commercial-grade reliability with low-voltage core: 1.14 V–1.26 V core supply and 0 °C–85 °C operating range meet typical commercial application requirements.
• Ecosystem support: Device aligns with ECP3 family tooling and configuration features described in the LatticeECP3 documentation to aid development and deployment.

Why Choose LFE3-17EA-8LFN484C?

The LFE3-17EA-8LFN484C delivers a balanced mix of logic density, on-chip memory and high-speed interfacing in a compact 484-BBGA package, making it well suited for designs that require moderate to high integration without excessive board footprint. Its ECP3 family capabilities — including DSP resources, programmable I/O and SERDES support — provide a versatile platform for communications, embedded processing and signal-processing applications.

For design teams targeting commercial applications that need predictable performance, a comprehensive feature set and compatibility with the LatticeECP3 development ecosystem, this device offers a practical, production-ready FPGA option.

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