LFE3-17EA-8LFTN256C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 716800 17000 256-BGA |
|---|---|
| Quantity | 559 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 716800 |
Overview of LFE3-17EA-8LFTN256C – ECP3 FPGA, 17,000 logic elements, 256-BGA
The LFE3-17EA-8LFTN256C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a mid-density programmable logic fabric with 17,000 logic elements and on-chip embedded memory for customizable digital logic implementations.
Designed for reconfigurable designs that require moderate embedded memory, a defined number of I/Os, and a compact Ball Grid Array package, this device is suitable for commercial-grade applications operating within standard temperature and voltage ranges.
Key Features
- Core Capacity 17,000 logic elements supporting configurable digital logic implementations and adaptable hardware functions.
- Logic Array Blocks 2,125 logic array blocks (LABs) to structure and map logic resources efficiently.
- Embedded Memory Approximately 0.72 Mbits of on-chip RAM (716,800 total RAM bits) for buffering, processing, and state storage within user designs.
- I/O Resources Up to 133 general-purpose I/Os to interface with peripherals, sensors, and other system components.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
- Package & Mounting 256-BGA package in a 256-FTBGA (17 × 17) footprint, intended for surface-mount PCB assembly.
- Temperature & Grade Commercial grade operation from 0°C to 85°C.
- Compliance RoHS-compliant for environmental regulation conformance.
Typical Applications
- Custom digital logic Implement glue logic, protocol handling, or application-specific accelerators where reprogrammability and 17,000 logic elements provide design flexibility.
- Interface bridging Use the 133 I/Os to connect and translate between multiple digital interfaces or to aggregate sensor and peripheral signals.
- Embedded control and state machines Leverage the on-chip RAM and logic resources for deterministic control, sequencing, and real-time finite-state implementations.
- Prototyping and development Deploy as a reconfigurable platform for hardware prototyping that requires a mid-density FPGA with a compact BGA package.
Unique Advantages
- Significant mid-range logic capacity: 17,000 logic elements enable complex combinational and sequential logic without moving to larger, higher-cost devices.
- Structured logic resources: 2,125 LABs help organize designs and map logic efficiently across the fabric.
- On-chip memory for local buffering: Approximately 0.72 Mbits of embedded RAM reduces dependence on external memory for many control and data-path tasks.
- Generous I/O count: 133 I/Os support multiple peripherals and interfaces directly, simplifying board-level connectivity.
- Compact BGA footprint: 256-FTBGA (17×17) package provides a dense, surface-mount solution for space-constrained PCBs.
- Low-voltage core operation: 1.14–1.26 V supply range supports modern low-voltage system designs.
Why Choose LFE3-17EA-8LFTN256C?
The LFE3-17EA-8LFTN256C positions itself as a practical, reconfigurable FPGA option for designers needing a balance of logic capacity, embedded memory, and I/O resources in a compact surface-mount BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard embedded applications.
This device is well suited to teams and projects that require on-board reprogrammability, moderate on-chip RAM, and a defined I/O count while keeping PCB footprint compact. Backed by Lattice Semiconductor as the manufacturer, it offers a predictable platform for mid-density programmable logic needs.
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