LFE3-17EA-8LFTN256C

IC FPGA 133 I/O 256FTBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 133 716800 17000 256-BGA

Quantity 559 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O133Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits716800

Overview of LFE3-17EA-8LFTN256C – ECP3 FPGA, 17,000 logic elements, 256-BGA

The LFE3-17EA-8LFTN256C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a mid-density programmable logic fabric with 17,000 logic elements and on-chip embedded memory for customizable digital logic implementations.

Designed for reconfigurable designs that require moderate embedded memory, a defined number of I/Os, and a compact Ball Grid Array package, this device is suitable for commercial-grade applications operating within standard temperature and voltage ranges.

Key Features

  • Core Capacity  17,000 logic elements supporting configurable digital logic implementations and adaptable hardware functions.
  • Logic Array Blocks  2,125 logic array blocks (LABs) to structure and map logic resources efficiently.
  • Embedded Memory  Approximately 0.72 Mbits of on-chip RAM (716,800 total RAM bits) for buffering, processing, and state storage within user designs.
  • I/O Resources  Up to 133 general-purpose I/Os to interface with peripherals, sensors, and other system components.
  • Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
  • Package & Mounting  256-BGA package in a 256-FTBGA (17 × 17) footprint, intended for surface-mount PCB assembly.
  • Temperature & Grade  Commercial grade operation from 0°C to 85°C.
  • Compliance  RoHS-compliant for environmental regulation conformance.

Typical Applications

  • Custom digital logic  Implement glue logic, protocol handling, or application-specific accelerators where reprogrammability and 17,000 logic elements provide design flexibility.
  • Interface bridging  Use the 133 I/Os to connect and translate between multiple digital interfaces or to aggregate sensor and peripheral signals.
  • Embedded control and state machines  Leverage the on-chip RAM and logic resources for deterministic control, sequencing, and real-time finite-state implementations.
  • Prototyping and development  Deploy as a reconfigurable platform for hardware prototyping that requires a mid-density FPGA with a compact BGA package.

Unique Advantages

  • Significant mid-range logic capacity: 17,000 logic elements enable complex combinational and sequential logic without moving to larger, higher-cost devices.
  • Structured logic resources: 2,125 LABs help organize designs and map logic efficiently across the fabric.
  • On-chip memory for local buffering: Approximately 0.72 Mbits of embedded RAM reduces dependence on external memory for many control and data-path tasks.
  • Generous I/O count: 133 I/Os support multiple peripherals and interfaces directly, simplifying board-level connectivity.
  • Compact BGA footprint: 256-FTBGA (17×17) package provides a dense, surface-mount solution for space-constrained PCBs.
  • Low-voltage core operation: 1.14–1.26 V supply range supports modern low-voltage system designs.

Why Choose LFE3-17EA-8LFTN256C?

The LFE3-17EA-8LFTN256C positions itself as a practical, reconfigurable FPGA option for designers needing a balance of logic capacity, embedded memory, and I/O resources in a compact surface-mount BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard embedded applications.

This device is well suited to teams and projects that require on-board reprogrammability, moderate on-chip RAM, and a defined I/O count while keeping PCB footprint compact. Backed by Lattice Semiconductor as the manufacturer, it offers a predictable platform for mid-density programmable logic needs.

Request a quote or submit an inquiry to receive pricing and availability for the LFE3-17EA-8LFTN256C.

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