LFE3-17EA-8LMG328I

The LFE3-17EA-8LMG328I is a member of the LatticeECP3 family: a reconfigurable FPGA fabric offering 17,000 logic elements, approximately 0.7 Mbits of embedded memory, and 116 user I/Os in a compact 328‑LFBGA (328‑CSBGA, 10 × 10 mm) package. Designed for mid-range, high-integration designs, this device provides on-chip DSP resources, programmable I/O flexibility and embedded SERDES capability to support common high-speed serial protocols.

With industrial grading and an operating range from −40 °C to 100 °C, and a core supply requirement of 1.14 V to 1.26 V, this device targets applications that need reliable, compact FPGA integration in systems requiring robust I/O and signal processing capabilities.

Key Features

• Core Capacity — 17,000 logic elements (LUT-based fabric) suitable for mid-density system integration and custom logic implementation.
• Memory — Approximately 0.7 Mbits of embedded block RAM (sysMEM) and additional distributed RAM resources for buffering, packet queues and on-chip storage.
• sysDSP — Dedicated DSP slice architecture for multiply-accumulate and high-performance arithmetic, including support for advanced MAC operations.
• Embedded SERDES and High‑Speed Interfaces — Device family supports embedded SERDES with per-channel data rates up to multi‑hundreds of Mbps to multiple Gbps; this package maps to 2 SERDES channels alongside 116 I/Os for serial protocol support.
• Programmable sysI/O — Wide range of on-chip supported I/O standards and features such as on‑chip termination, DDR registers in I/O cells, and source synchronous support for memory and ADC/DAC interfaces.
• Clocking and Timing — Up to two PLLs and two DLLs (device family values) for flexible clock management and source synchronous interfaces.
• Packaging and Power — 328‑CSBGA (10 × 10 mm) package; core voltage range 1.14 V to 1.26 V and RoHS compliant.
• Industrial Reliability — Industrial-grade operating temperature from −40 °C to 100 °C for use in demanding environments.
• Configuration and System Tools — Family-level support for flexible configuration options including SPI boot, dual-boot images, and system utilities referenced in the LatticeECP3 data sheet.

Typical Applications

• High‑Speed Communications — Implement network endpoints and protocol engines for interfaces such as 1GbE, SGMII, XAUI, PCI Express and Serial RapidIO using the device’s SERDES and programmable I/O.
• Wireless and Fronthaul — Support for CPRI links and other serial transport protocols where embedded SERDES channels and deterministic timing are required.
• Broadcast Video Equipment — SMPTE 3G and related video transport processing with on‑chip DSP and memory resources for buffering and timing.
• Industrial Systems — Industrial-grade operation and flexible I/O standards for deterministic control, sensor interfacing, and networked industrial equipment.

Unique Advantages

• Balanced Logic and Memory — 17K logic elements paired with approximately 0.7 Mbits of embedded RAM provide a compact, balanced platform for control, packet processing and mid‑scale DSP tasks.
• SerDes and I/O Density — 116 user I/Os and mapped SERDES channels enable mixed parallel and serial connectivity without external multiplexing logic.
• Dedicated DSP Slices — sysDSP architecture supports efficient multiply‑accumulate operations, reducing resource usage for compute‑intensive algorithms.
• Compact Package — 328‑CSBGA (10 × 10 mm) footprint lets you integrate FPGA capability into space-constrained PCBs while retaining substantial I/O and SERDES capability.
• Industrial Temperature Range — Rated from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Flexible Configuration — Supports SPI boot, dual-boot images and other configuration options for field updates and secure image management as referenced in the device family documentation.

Why Choose LFE3-17EA-8LMG328I?

This LatticeECP3 device provides a pragmatic combination of logic density, embedded memory and serial/I/O capability in a compact industrial-grade package. It suits designers who need mid-range FPGA resources with on‑chip DSP and SERDES support for communications, video transport and industrial networked systems.

Choosing this part delivers a scalable, manufacturer‑documented FPGA platform with family-level system utilities and configuration flexibility, making it appropriate for production deployments where integration density, protocol support and temperature robustness are required.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time details for the LFE3-17EA-8LMG328I. Technical documentation is available in the LatticeECP3 family data sheet referenced for further integration details.