LFE3-17EA-8LFN484I

The LFE3-17EA-8LFN484I is a Lattice ECP3 family field programmable gate array (FPGA) in a 484-ball FBGA package. It provides a balanced combination of programmable logic, embedded memory, and high-speed I/O suitable for high-volume, high-speed, cost-sensitive applications.

Built on the ECP3 device architecture, this device targets designs requiring moderate logic density with integrated SERDES, dedicated DSP resources, and flexible I/O support while operating from a 1.14 V to 1.26 V core supply and across an industrial temperature range.

Key Features

• Core Logic 17,000 logic elements (LUT-based logic) for implementing control, glue logic, and mid-density processing functions.
• Embedded Memory Approximately 716.8 Kbits of on-chip RAM to support buffering, FIFOs, and packet or data storage without external memory.
• High-Speed I/O & SERDES 222 user I/Os in a 484-ball package with embedded SERDES support. The ECP3 family supports SERDES data rates referenced in the family datasheet from 150 Mbps up to 3.2 Gbps for various serial protocols.
• sysDSP and DSP Slices Family-level sysDSP architecture with cascadable slices and wide ALU capabilities for multiply-accumulate and signal processing tasks (as documented for the ECP3 family).
• Configuration & System Support Flexible device configuration features are provided at the family level, including SPI boot flash interface, dual-boot support, and on-chip configuration utilities and tools referenced in the datasheet.
• Package, Power and Temperature 484-FPBGA (23 × 23 mm) package, 1.14 V to 1.26 V core supply range, and industrial operating temperature from −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Telecommunications & Networking Use embedded SERDES and programmable I/O to implement application-level PHY bridging, protocol conversion, or packet pre-processing in network equipment.
• Video and Broadcast Interfaces Leverage on-chip memory and DSP resources for frame buffering, timing alignment, and interface bridging for video transport standards referenced by the family.
• Industrial Control & Automation Deploy the industrial-temperature-rated FPGA for control logic, sensor interfacing, and deterministic I/O processing in factory and process automation.
• Mixed-Signal Front End Integration Pair the device’s flexible I/O standards and embedded RAM to handle ADC/DAC interfacing, gating, and preprocessing tasks.

Unique Advantages

• Balanced Logic and Memory 17,000 logic elements with approximately 716.8 Kbits of embedded RAM reduce reliance on external memory and simplify board design.
• Integrated High-Speed I/O 222 I/Os and family-level SERDES capability allow direct implementation of high-speed serial links and parallel interfaces without adding separate transceivers.
• Industrial Temperature Capability Certified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Low-Voltage Core Operation 1.14 V to 1.26 V core supply supports modern low-voltage system designs and power budgeting.
• Proven Family-Level Tools and Features Device benefits from ECP3 family configuration utilities and system-level support referenced in the datasheet, streamlining development and deployment.

Why Choose LFE3-17EA-8LFN484I?

The LFE3-17EA-8LFN484I positions itself as a compact, industrial-temperature FPGA solution within the Lattice ECP3 family, offering a practical mix of logic capacity, embedded memory, and extensive I/O for mid-density applications. Its combination of on-chip RAM, sysDSP capabilities (as described for the family), and SERDES-enabled I/O makes it suitable for designs that require integrated processing, buffering, and high-speed interfacing while minimizing external components.

This device is well suited to engineers designing telecommunications, video, industrial control, and mixed-signal front-end applications who need a verified FPGA architecture with configuration flexibility and system-level support referenced in the family datasheet.

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