LFE3-17EA-8LFTN256I

The LFE3-17EA-8LFTN256I is a Lattice Semiconductor ECP3 family Field Programmable Gate Array (FPGA) in a 256‑ball FTBGA (17 × 17 mm) package. It provides 17,000 logic elements, approximately 0.72 Mbits of embedded RAM, and up to 133 user I/Os, making it suitable for designs that require mid-range logic density, on‑chip memory, and flexible high‑speed I/O support.

Built on the LatticeECP3 architecture, this device targets high‑volume, high‑speed, and cost‑sensitive applications that benefit from embedded DSP resources, SERDES channels, and configurable memory and I/O features while operating from a low‑voltage core supply.

Key Features

• Core Logic 
  17,000 logic elements providing mid-range LUT capacity for control, glue logic, and moderate-complexity programmable functions.
• Embedded Memory 
  Total RAM bits: 716,800 (approximately 0.72 Mbits) of on‑chip embedded memory for FIFOs, buffers, and state storage.
• DSP and Arithmetic Resources 
  sysDSP architecture with dedicated multiplier resources (24 × 18×18 multipliers for the ECP3‑17 device family) to accelerate multiply/accumulate and signal processing tasks.
• SERDES and High‑Speed I/O 
  Package supports up to 4 SERDES channels and 133 user I/Os, enabling serial protocols and parallel interfaces in compact board layouts.
• Programmable I/O Standards 
  Flexible I/O buffer support across common standards (as implemented in the ECP3 family) for varied parallel and differential interfaces.
• Clocking and Timing 
  On‑chip timing resources including PLLs and DLLs (2 PLLs and 2 DLLs for the ECP3‑17 device family) to support clock management and source synchronous interfaces.
• Power 
  Core voltage supply range: 1.14 V to 1.26 V for low‑voltage operation.
• Package and Mounting 
  256‑BGA (256‑FTBGA, 17 × 17 mm) surface‑mount package suitable for space‑constrained board designs.
• Temperature and Reliability 
  Industrial grade with operating temperature range from −40 °C to 100 °C and RoHS compliance.

Typical Applications

• Telecommunications and Networking 
  Ideal for protocol bridging and interface aggregation using available SERDES channels for protocols such as PCI Express, Ethernet, SONET/SDH, CPRI, and Serial RapidIO (as supported by the ECP3 family).
• Embedded Signal Processing 
  sysDSP slices and dedicated multipliers accelerate filtering, FFTs, and MAC operations for mid‑range DSP tasks.
• Memory Interface and Buffering 
  On‑chip RAM and source‑synchronous I/O features support DDR/DDR2/DDR3 style memory interfaces and data capture/retiming functions.
• Industrial Control and Instrumentation 
  Industrial temperature rating and flexible I/O make the device suitable for control logic, data acquisition front‑ends, and deterministic interfacing in industrial systems.

Unique Advantages

• Mid‑range logic density 
  17,000 logic elements provide a balance between integration and cost for designs that do not require the largest FPGA families.
• Integrated DSP resources 
  sysDSP architecture and 18×18 multipliers help offload compute‑intensive signal processing from external processors, reducing BOM and system complexity.
• Flexible high‑speed I/O 
  133 user I/Os plus up to 4 SERDES lanes in the 256‑FTBGA package enable both parallel and serial interface options on a compact footprint.
• Compact, board‑friendly package 
  256‑ball FTBGA (17 × 17 mm) delivers dense integration for space‑constrained applications while maintaining robust I/O capacity.
• Industrial temperature and RoHS compliance 
  Rated for −40 °C to 100 °C operation and RoHS compliant for industrial deployments and regulatory compatibility.
• Low‑voltage core 
  1.14 V to 1.26 V core supply supports power‑sensitive designs and modern board power architectures.

Why Choose LFE3-17EA-8LFTN256I?

The LFE3-17EA-8LFTN256I delivers a balanced mix of logic capacity, embedded memory, DSP acceleration, and versatile I/O in a compact 256‑ball FTBGA package. It is positioned for designers who need mid‑range FPGA capability with dedicated resources for high‑speed serial links, signal processing, and memory interfacing while maintaining industrial temperature performance and low‑voltage operation.

This device is well suited for engineers designing communications equipment, embedded signal processing modules, and industrial control systems who require a reliable, integrable FPGA option backed by the Lattice ECP3 family architecture and tooling ecosystem.

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