LFE3-17EA-8MG328I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 116 716800 17000 328-LFBGA, CSBGA |
|---|---|
| Quantity | 451 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 328-CSBGA (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 328-LFBGA, CSBGA | Number of I/O | 116 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 716800 |
Overview of LFE3-17EA-8MG328I – ECP3 FPGA, 17,000 Logic Elements, 328-LFBGA
The LFE3-17EA-8MG328I is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation that integrates 17,000 logic elements and approximately 0.72 Mbits of embedded memory. Supplied in a 328-pin LFBGA/CSBGA package and rated for industrial temperatures, it delivers a balanced combination of on-chip logic, memory, and I/O density for compact, rugged designs.
Key Features
- Logic Capacity — 17,000 logic elements provide programmable fabric for implementing custom logic, state machines, and glue functions.
- Embedded Memory — Approximately 0.72 Mbits of on-chip RAM supports buffering, FIFOs, and small data stores directly in the FPGA.
- I/O Density — 116 user I/Os accommodate multiple peripheral interfaces, sensor connections, and external logic interconnects.
- Power — Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulator selections.
- Package & Mounting — Available in a 328-LFBGA (328-CSBGA, 10×10) package for surface-mount PCB assembly where high pin-count in a compact footprint is required.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Regulatory Compliance — RoHS compliant to support environmentally conscious manufacturing and assembly.
Typical Applications
- Industrial Control — Use the industrial temperature rating and on-chip logic to implement sensor interfacing, motion control sequencing, and custom control algorithms.
- I/O Consolidation and Protocol Bridging — Leverage 116 user I/Os to consolidate peripherals, perform protocol translation, or serve as a programmable I/O hub in compact systems.
- Embedded Glue Logic — Deploy the FPGA’s 17,000 logic elements and embedded RAM to integrate custom glue logic, bus arbitration, and interface timing without additional discrete components.
Unique Advantages
- Balanced On-chip Resources: 17,000 logic elements paired with ~0.72 Mbits of RAM provide room to implement moderate-complexity designs without external memory.
- High I/O Count in a Compact Package: 116 I/Os in a 328-LFBGA (328-CSBGA, 10×10) package enables dense connectivity while minimizing PCB area.
- Industrial Reliability: −40 °C to 100 °C operating range and surface-mount package options support deployment in industrial environments.
- Tight Core Voltage Window: 1.14 V to 1.26 V supply range allows precise power budgeting and compatibility with regulated core supplies.
- RoHS Compliance: Environmentally compliant construction helps meet production and sourcing requirements.
Why Choose LFE3-17EA-8MG328I?
The LFE3-17EA-8MG328I positions itself as a practical choice for designers who need a moderate logic capacity FPGA with substantial I/O and on-chip memory in a compact, industrial-temperature package. Its combination of 17,000 logic elements, approximately 0.72 Mbits of embedded RAM, and 116 user I/Os makes it well suited to embedded systems, industrial controls, and designs that require flexible, board-level integration without large external memory or peripheral stacks.
As an offering from Lattice Semiconductor Corporation, the device provides a specific set of resources and package options that help balance PCB space, I/O needs, and environmental requirements for medium-complexity programmable logic applications.
Request a quote today for LFE3-17EA-8MG328I to evaluate its fit for your next design or to obtain pricing and availability information.

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