LFE3-17EA-8LMG328C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 116 716800 17000 328-LFBGA, CSBGA |
|---|---|
| Quantity | 1,097 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 328-CSBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 328-LFBGA, CSBGA | Number of I/O | 116 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 716800 |
Overview of LFE3-17EA-8LMG328C – ECP3 Field Programmable Gate Array (FPGA), 17K Logic Elements, 116 I/Os
The LFE3-17EA-8LMG328C is an ECP3 family FPGA IC from Lattice Semiconductor, built on a reconfigurable SRAM fabric optimized for cost-sensitive, high-performance designs. This commercial-grade device integrates 17,000 logic elements, on-chip RAM, DSP resources and high-speed I/O to address embedded systems, communications and signal-processing applications that require a balance of performance and integration.
Designed for surface-mount assembly in a 328-LFBGA (328-CSBGA, 10×10 mm) package, the device operates from a 1.14 V to 1.26 V supply and across a commercial temperature range of 0 °C to 85 °C, with RoHS compliance noted.
Key Features
- Logic Capacity 17,000 logic elements for implementing glue logic, state machines and moderate-complexity FPGA designs.
- On-chip Memory 716,800 bits of total RAM (approximately 0.72 Mbits) to support buffering, FIFOs and embedded data storage.
- High-performance DSP sysDSP architecture with dedicated multiplier resources (table data lists 24 18×18 multipliers) for multiply-accumulate and signal-processing functions.
- Embedded SERDES Integrated SERDES capability with device-family data rates from 150 Mbps to 3.2 Gbps and SERDES channel support appropriate to the 328 csBGA package (2 channels / 116 I/Os in the package mapping).
- I/O and Interface Flexibility 116 user I/Os with programmable sysI/O buffer support for a wide range of standards, on-chip termination and source-synchronous features per the ECP3 family data.
- Clocking and Timing Multiple clock-management resources consistent with the family: PLLs and DLLs (family table indicates 2 PLLs and 2 DLLs for the ECP3-17 class).
- Power and Packaging Surface-mount 328-LFBGA (328-CSBGA, 10×10 mm) package, supply range 1.14 V to 1.26 V and a 1.2 V core power reference in the family data.
- Commercial Temperature Grade & Compliance Rated for 0 °C to 85 °C operation and RoHS compliant.
Typical Applications
- Communications & Networking Use embedded SERDES and flexible I/O to implement serial links, protocol bridging and network aggregation functions.
- Signal Processing Leverage sysDSP slices and dedicated multipliers for filtering, FFTs and other DSP workloads in embedded devices.
- Embedded Control & Interface Implement control logic, peripheral bridging and custom I/O handling using the device’s 17K logic elements and 116 general-purpose I/Os.
Unique Advantages
- Balanced logic and memory Combines 17,000 logic elements with ~0.72 Mbits of on-chip RAM to support mixed logic and buffering needs without external RAM for many designs.
- Integrated DSP resources Dedicated multipliers and the sysDSP architecture reduce the need for external DSP components in signal-processing applications.
- High-speed serial capability Embedded SERDES with multi-hundred-Mbps to multi-Gbps support enables implementation of modern serial protocols in a compact package.
- Flexible I/O standards Programmable sysI/O buffers and on-chip termination simplify interfacing to a wide range of external devices and memory types.
- Compact, surface-mount package The 328-CSBGA (10×10 mm) package provides a small footprint option with 116 user I/Os for space-constrained designs.
- Commercial-grade availability Operates across a 0 °C to 85 °C range suitable for many consumer and industrial-adjacent applications where commercial temperature grade is acceptable.
Why Choose LFE3-17EA-8LMG328C?
This ECP3-17 device offers a pragmatic combination of logic capacity, on-chip memory and DSP resources in a compact 328-CSBGA package. It is well suited to designers who need embedded signal-processing capability, flexible I/O and multi‑Gbps serial links while maintaining a small board footprint and commercial temperature operation.
Choosing the LFE3-17EA-8LMG328C provides scalable FPGA functionality tied to the Lattice ECP3 family architecture—making it a practical option for mid-range FPGA applications that require integration of logic, memory and high-speed interfaces with vendor-supported device features.
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