LFE3-35EA-6FN484C

The LFE3-35EA-6FN484C is a Lattice ECP3 family Field Programmable Gate Array (FPGA) in a 484‑BBGA package optimized for mid-range integration. It combines 33,000 logic elements with approximately 1.36 Mbits of on-chip RAM and 295 general-purpose I/Os to address high-volume, high-speed, cost-sensitive applications.

Built on the LatticeECP3 architecture, the device targets system designs that require a balance of logic density, embedded memory, and flexible I/O in a compact surface-mount footprint.

Key Features

• Core Logic 33,000 logic elements provide mid-range programmable logic capacity for complex control, glue-logic, and protocol processing.
• Embedded Memory Approximately 1.36 Mbits of on-chip RAM for buffering, FIFOs, and small shared data structures.
• I/O and Interfaces 295 I/Os support a wide array of external interfaces and board-level connectivity requirements.
• Package and Mounting 484‑BBGA package (484‑FPBGA, 23 × 23 mm) in a surface-mount form factor suitable for compact, dense board layouts.
• Power Core voltage supply range of 1.14 V to 1.26 V for the programmable fabric.
• Temperature Grade Commercial temperature rating with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant.
• Family-Level Capabilities (LatticeECP3) The ECP3 family provides features such as embedded DSP slices, high-speed SERDES channels, and flexible programmable I/O standards, enabling scalable designs across the family.

Typical Applications

• Networking & Communications Protocol bridging, interface adaptation, and mid-density packet processing where multiple I/Os and embedded memory aid system integration.
• High-Speed I/O Subsystems Board-level aggregation and timing-critical interfaces that leverage the device’s large I/O count and family SERDES/I/O capabilities.
• Embedded Control & Signal Processing Control logic, data buffering, and DSP-accelerated functions that fit within the device’s logic and on-chip memory constraints.

Unique Advantages

• Balanced Logic Density: 33,000 logic elements provide a mid-range platform for consolidating multiple functions without overprovisioning.
• Generous I/O Count: 295 I/Os enable broad system interfacing and minimize the need for external I/O expanders.
• Compact, Surface-Mount Package: The 484‑BBGA (23 × 23 mm) package supports dense PCB designs while providing a large I/O footprint.
• On-Chip Memory: Approximately 1.36 Mbits of embedded RAM for local buffering and state storage reduces dependence on external memory for many use cases.
• Low Core Voltage: 1.14–1.26 V core supply supports modern power architectures and efficient power budgeting.
• Commercial Temperature Range: 0 °C to 85 °C rating aligns with a wide range of consumer and industrial‑class electronics applications.

Why Choose LFE3-35EA-6FN484C?

The LFE3-35EA-6FN484C provides a practical balance of logic, embedded memory, and a high I/O count in a compact 484‑BBGA surface-mount package, making it well suited for designers who need mid-range FPGA resources with flexible board-level connectivity. As part of the LatticeECP3 family, it benefits from the family’s architecture and supporting tools, allowing designs to scale within the same device family.

This device is a fit for teams building high-volume, performance-conscious systems that require predictable power, a commercial temperature rating, and RoHS compliance—delivering long-term value through a consistent feature set across the ECP3 product family.

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