LFE3-35EA-6FTN256C

The LFE3-35EA-6FTN256C is a member of the Lattice ECP3 family of Field Programmable Gate Arrays (FPGAs), delivering a balanced combination of logic capacity, embedded memory and high-speed I/O in a compact 256‑FTBGA (17×17 mm) surface-mount package. Built on the ECP3 architecture, this commercial-grade device targets high-volume applications that require programmable logic, embedded RAM and SERDES-enabled interfaces.

With approximately 33,000 logic elements, roughly 1.36 Mbits of on-chip RAM and 133 user I/Os, the device is suitable for communications, video/broadcast, industrial control and general embedded system designs that benefit from flexible I/O and DSP resources.

Key Features

• Core Fabric  Approximately 33,000 logic elements to implement control, glue-logic and medium-complexity processing functions.
• Embedded Memory  Approximately 1.36 Mbits of total on-chip RAM for buffering, FIFOs and working storage.
• DSP and Arithmetic Resources  ECP3 family architecture provides enhanced sysDSP capabilities; the ECP3-35 device class includes 64 18×18 multipliers for efficient multiply/accumulate operations.
• High-Speed SERDES  Family SERDES support extends to multi‑hundred Mbps and multi‑Gbps modes; the 256‑FTBGA package supports up to 4 SERDES channels and 133 user I/Os per the family package mapping.
• Flexible sysI/O™ Buffer and Standards  Programmable I/O supports a broad set of standards including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL, PCI and differential interfaces such as LVDS, Bus‑LVDS and LVPECL for interoperable board-level designs.
• Configuration and Boot Options  Supports SPI boot flash interface, dual-boot images, slave SPI and TransFR I/O for field updates and flexible configuration flows.
• Clocking and Timing  Family-level sysCLOCK resources include PLLs and DLLs to support system timing and source-synchronous interfaces.
• Package and Power  256‑ball FTBGA (17×17 mm) surface-mount package; device voltage supply range 1.14 V to 1.26 V consistent with the 1.2 V core supply used by the family.
• Operating Conditions and Compliance  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• System Support  Family supports system-level tools and standards such as IEEE 1149.1, IEEE 1532, Reveal logic analyzer and ORCAstra configuration utility.

Typical Applications

• Communications & Networking  Use the device’s SERDES channels and flexible I/O standards to implement protocol bridging, packet processing and interface conversion in networked systems.
• Video and Broadcast Processing  Leverage the DSP resources and embedded RAM for video pipeline elements, buffering and timing-critical data paths.
• Embedded System Control  Implement custom control logic, sensor interfaces and protocol glue in compact embedded platforms using the 33K logic elements and abundant I/Os.
• Storage and Memory Interfaces  Use dedicated DDR/DDR2/DDR3 memory support and source-synchronous I/O features in board designs that require external memory buffering and high-speed data transfer.

Unique Advantages

• Balanced logic and memory ratio: The combination of ~33K logic elements and ~1.36 Mbits of embedded RAM supports both control logic and moderate buffering without external FPGA fabric.
• Integrated SERDES capability: Up to 4 SERDES channels in the 256‑FTBGA package enable high-speed serial interfaces while preserving general-purpose I/O density.
• Wide I/O standard support: Programmable sysI/O buffers and on-chip termination options simplify interfacing to a broad range of single‑ended and differential standards.
• Flexible configuration options: SPI boot, dual-boot and TransFR I/O support allow field updates and multiple deployment strategies for firmware and configuration images.
• Commercial temperature and RoHS compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant manufacturing to meet typical commercial product requirements.

Why Choose LFE3-35EA-6FTN256C?

The LFE3-35EA-6FTN256C places a practical mix of logic, memory and SERDES-enabled I/O into a compact 256‑FTBGA package, making it well suited for designers who need programmable logic with on-chip RAM and high-speed interface options in commercial applications. Its feature set—approximately 33K logic elements, about 1.36 Mbits of embedded RAM, 133 I/Os and family-level DSP and SERDES support—enables integration of protocol bridging, data buffering and signal processing while keeping board-level complexity manageable.

This device is an appropriate choice for teams building communications equipment, video/broadcast subsystems, embedded controllers and interface-rich products that benefit from a scalable FPGA fabric and the ECP3 family’s system-level features and tools.

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