LFE3-35EA-6FTN256I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 184 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-6FTN256I – ECP3 FPGA, 33,000 Logic Elements, 256‑BGA
The LFE3-35EA-6FTN256I is an ECP3 field-programmable gate array (FPGA) from Lattice Semiconductor designed for industrial applications. It delivers 33,000 logic elements, approximately 1.36 Mbits of on-chip RAM and 133 user I/Os in a compact 256‑FTBGA (17 × 17 mm) package.
As a member of the LatticeECP3 family, this device is positioned for designs that require a balance of programmable logic, embedded memory and flexible high-speed I/O, while operating across an industrial temperature range.
Key Features
- Core Logic Provides 33,000 logic elements suitable for mid-density FPGA designs requiring considerable gate count and logic resources.
- Embedded Memory Approximately 1.36 Mbits of on-chip RAM (Total Ram Bits: 1,358,848) for buffers, FIFOs and on-chip data storage.
- I/O Density 133 user I/Os available in the 256‑FTBGA package for flexible interface routing and board-level connectivity.
- High‑Speed Serial Support (Family Feature) LatticeECP3 family supports embedded SERDES with data rates from 150 Mbps up to 3.2 Gbps for common protocols and serial links.
- DSP and Arithmetic Acceleration (Family Feature) sysDSP architecture in the ECP3 family enables high-performance multiply and accumulate operations suitable for signal processing tasks.
- Clocking Resources (ECP3‑35) Includes multiple PLLs and DLLs (ECP3‑35: 4 PLLs / 2 DLLs) to support flexible clock management and clock domain crossings.
- Configuration and System Support Family-configurable features include SPI boot flash interface, dual-boot image support and on-chip soft error detect macros for robust configuration options.
- Power and Package Core voltage supply range 1.14 V to 1.26 V; surface-mount 256‑FTBGA (17 × 17 mm) package for compact PCB integration.
- Industrial Temperature Range Specified to operate from −40 °C to 100 °C, suitable for industrial environments.
- RoHS Compliant Device meets RoHS requirements for lead-free manufacturing.
Typical Applications
- High‑Speed Communications Implement SERDES-based links and protocol interfaces (for example PCIe, Ethernet, CPRI) using the ECP3 family’s high-speed serial capabilities.
- Signal Processing and DSP Use sysDSP and embedded arithmetic resources for real-time filtering, FFTs and other DSP kernels.
- Video and Broadcast Interfaces Support SMPTE and other high-bandwidth video transport protocols leveraging on-chip memory and SERDES features in the family.
- Industrial Control and Instrumentation Deploy where robust I/O, industrial temperature operation and compact BGA packaging are required for control, monitoring and automation systems.
Unique Advantages
- Balanced Logic and Memory Capacity: 33,000 logic elements combined with ~1.36 Mbits of embedded RAM enable compact implementations of control logic, buffering and moderate data-paths on a single device.
- Flexible I/O Count in a Small Footprint: 133 user I/Os in a 17 × 17 mm 256‑FTBGA package reduce board area while preserving connectivity for complex systems.
- Industrial Temperature Rating: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions common to industrial applications.
- Configurable Boot and Update Options: Support for SPI boot and dual-boot images simplifies field updates and system-level configuration management.
- Family-Level High‑Speed Serial and DSP Ecosystem: Access to LatticeECP3 family features—such as SERDES and sysDSP—enables scalable designs and reuse across product variants.
Why Choose LFE3-35EA-6FTN256I?
LFE3-35EA-6FTN256I offers a practical mid-range FPGA solution for designers who need a blend of logic capacity, embedded memory and flexible I/O in an industrial-grade package. Its electrical and thermal specifications make it suitable for industrial systems that require stable operation across harsh environments.
Being part of the LatticeECP3 family, this device benefits from family-level features for high-speed serial links, DSP acceleration and robust configuration options, providing a scalable platform for communications, video processing and industrial control applications.
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