LFE3-35EA-6LFN672C

The LFE3-35EA-6LFN672C is an ECP3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a combination of logic density, embedded memory and I/O capacity in a compact 672-ball BGA package for commercial-grade board-level designs.

Key on‑chip resources include 33,000 logic elements, approximately 1.36 Mbits of embedded memory, and 310 user I/O pins. The device is specified for a supply voltage range of 1.14 V to 1.26 V and commercial operating temperatures from 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Density  33,000 logic elements provide substantial programmable logic capacity for mid-density implementations.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM to support buffering, packet processing, and other local storage needs.
• I/O Capacity  310 user I/O pins enable extensive peripheral interfacing and system integration options.
• Power  Specified supply voltage range of 1.14 V to 1.26 V to match target board power rails and design constraints.
• Package & Mounting  672-ball FPBGA in a 27 × 27 mm footprint (672-BBGA / 672-FPBGA) for high-density, surface-mount board layouts.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-density I/O systems  Use the 310 user I/Os to consolidate multiple interfaces and simplify board-level routing.
• Mid-range logic integration  33,000 logic elements support custom digital logic, glue logic, and protocol adaptation tasks.
• Memory-assisted processing  Approximately 1.36 Mbits of embedded RAM enables local buffering and small on-chip data stores for control and processing functions.
• Compact board-level implementations  The 672-ball BGA package and surface-mount mounting make the device suitable for space-constrained PCBs.

Unique Advantages

• Balanced logic and memory  The combination of 33,000 logic elements and ~1.36 Mbits of embedded RAM supports a wide range of mid-density designs without external memory for small data sets.
• Extensive I/O  With 310 I/O pins, the device reduces the need for additional I/O expanders and simplifies system integration.
• Compact, manufacturable package  672-FPBGA (27×27) package supports high-density placement while remaining suitable for surface-mount assembly.
• Defined commercial temperature range  Rated for 0 °C to 85 °C to meet the needs of commercial and industrial-adjacent deployments within that range.
• RoHS compliant  Facilitates lead‑free production processes and compliance with environmental regulations.

Why Choose LFE3-35EA-6LFN672C?

The LFE3-35EA-6LFN672C positions itself as a mid-density FPGA option that combines sizable programmable logic, meaningful embedded memory, and high I/O count in a compact 672-BBGA package. Its supply voltage range and commercial operating temperature make it suitable for a broad set of board-level designs requiring integrated logic and I/O consolidation.

This device is well suited for engineers who need to balance logic density, on-chip memory, and I/O capability while maintaining a compact footprint and RoHS compliance. The specification set supports scalable designs that can be implemented within the device’s commercial temperature and voltage constraints.

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