LFE3-35EA-6LFTN256C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 1,770 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1358848 |
Overview of LFE3-35EA-6LFTN256C – ECP3 FPGA, 33,000 logic elements, 133 I/O, 256‑BGA
The LFE3-35EA-6LFTN256C is a field programmable gate array (FPGA) from the Lattice ECP3 family. It delivers a reconfigurable SRAM-based fabric with 33,000 logic elements and flexible I/O capabilities suited to mid-density, high-speed digital designs.
Designed for cost-sensitive commercial applications, this device provides integrated memory, DSP resources and source-synchronous interfaces that help consolidate functions, reduce board-level complexity and accelerate system integration.
Key Features
- Logic Capacity Provides 33,000 logic elements to implement medium-complexity digital logic and control functions.
- Embedded Memory Total on-chip RAM of 1,358,848 bits — approximately 1.36 Mbits of embedded memory for buffers, FIFOs and state storage.
- DSP and Arithmetic ECP3 family sysDSP architecture supports cascaded multiply–accumulate operations and slice-level multipliers to accelerate signal-processing workloads.
- High-Speed Serial and Parallel I/O ECP3 family includes embedded SERDES and pre‑engineered source synchronous I/O support for common high-speed interfaces and protocols.
- Clocking Family-level sysCLOCK resources include analog PLLs and DLLs for flexible clock management and jitter control in system designs.
- Package and Mounting Supplied in a 256-FTBGA (17×17 mm) package, surface-mount compatible for compact board layouts.
- Power Core supply range between 1.14 V and 1.26 V to match system power rails and support low-voltage designs.
- Operating Range Commercial-grade temperature rating from 0 °C to 85 °C.
- Regulatory RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Networking & Telecom Hardware acceleration and protocol bridging using on-chip SERDES and source-synchronous I/O for Ethernet, PCI Express and telecom links referenced in the ECP3 family feature set.
- Video & Broadcast High-speed serial interfaces and DSP resources suitable for video transport and processing workflows such as SMPTE-related applications described in the family data.
- Storage & Interface Controllers Custom controller logic and interface bridging where moderate logic density and embedded memory are required.
- Embedded Signal Processing sysDSP architecture and embedded multipliers support filtering, accumulation and other DSP tasks within compact FPGA-based designs.
Unique Advantages
- Medium-density FPGA with substantial logic 33,000 logic elements enable a wide range of functions without moving to larger, more costly devices.
- Significant on-chip memory Approximately 1.36 Mbits of embedded RAM reduces external memory dependencies for buffering and state retention.
- Flexible I/O and package 133 user I/Os in a 256‑FTBGA (17×17 mm) package offers a compact footprint with ample connectivity for system I/O requirements.
- Low-voltage core Core supply range from 1.14 V to 1.26 V supports modern low-voltage power domains.
- Commercial-grade qualification Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.
Why Choose LFE3-35EA-6LFTN256C?
The LFE3-35EA-6LFTN256C positions itself as a balanced, mid-density FPGA offering from the Lattice ECP3 family — combining a sizable logic element count, on-chip memory and DSP-friendly architecture. It is well suited for designers who need to consolidate multiple digital functions, implement protocol interfaces or add on-board acceleration while keeping board area and BOM complexity under control.
This device is appropriate for commercial embedded systems, communications modules and interface logic where a combination of moderate logic capacity, flexible I/O and family-level high-speed features are required. The ECP3 family datasheet-backed architecture provides predictable scalability and integration for evolving designs.
Request a quote or submit a sales inquiry to obtain pricing, availability and additional product support information for LFE3-35EA-6LFTN256C.

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