LFE3-35EA-6LFTN256C

IC FPGA 133 I/O 256FTBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA

Quantity 1,770 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O133Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells33000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1358848

Overview of LFE3-35EA-6LFTN256C – ECP3 FPGA, 33,000 logic elements, 133 I/O, 256‑BGA

The LFE3-35EA-6LFTN256C is a field programmable gate array (FPGA) from the Lattice ECP3 family. It delivers a reconfigurable SRAM-based fabric with 33,000 logic elements and flexible I/O capabilities suited to mid-density, high-speed digital designs.

Designed for cost-sensitive commercial applications, this device provides integrated memory, DSP resources and source-synchronous interfaces that help consolidate functions, reduce board-level complexity and accelerate system integration.

Key Features

  • Logic Capacity  Provides 33,000 logic elements to implement medium-complexity digital logic and control functions.
  • Embedded Memory  Total on-chip RAM of 1,358,848 bits — approximately 1.36 Mbits of embedded memory for buffers, FIFOs and state storage.
  • DSP and Arithmetic  ECP3 family sysDSP architecture supports cascaded multiply–accumulate operations and slice-level multipliers to accelerate signal-processing workloads.
  • High-Speed Serial and Parallel I/O  ECP3 family includes embedded SERDES and pre‑engineered source synchronous I/O support for common high-speed interfaces and protocols.
  • Clocking  Family-level sysCLOCK resources include analog PLLs and DLLs for flexible clock management and jitter control in system designs.
  • Package and Mounting  Supplied in a 256-FTBGA (17×17 mm) package, surface-mount compatible for compact board layouts.
  • Power  Core supply range between 1.14 V and 1.26 V to match system power rails and support low-voltage designs.
  • Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C.
  • Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

  • Networking & Telecom  Hardware acceleration and protocol bridging using on-chip SERDES and source-synchronous I/O for Ethernet, PCI Express and telecom links referenced in the ECP3 family feature set.
  • Video & Broadcast  High-speed serial interfaces and DSP resources suitable for video transport and processing workflows such as SMPTE-related applications described in the family data.
  • Storage & Interface Controllers  Custom controller logic and interface bridging where moderate logic density and embedded memory are required.
  • Embedded Signal Processing  sysDSP architecture and embedded multipliers support filtering, accumulation and other DSP tasks within compact FPGA-based designs.

Unique Advantages

  • Medium-density FPGA with substantial logic  33,000 logic elements enable a wide range of functions without moving to larger, more costly devices.
  • Significant on-chip memory  Approximately 1.36 Mbits of embedded RAM reduces external memory dependencies for buffering and state retention.
  • Flexible I/O and package  133 user I/Os in a 256‑FTBGA (17×17 mm) package offers a compact footprint with ample connectivity for system I/O requirements.
  • Low-voltage core  Core supply range from 1.14 V to 1.26 V supports modern low-voltage power domains.
  • Commercial-grade qualification  Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.

Why Choose LFE3-35EA-6LFTN256C?

The LFE3-35EA-6LFTN256C positions itself as a balanced, mid-density FPGA offering from the Lattice ECP3 family — combining a sizable logic element count, on-chip memory and DSP-friendly architecture. It is well suited for designers who need to consolidate multiple digital functions, implement protocol interfaces or add on-board acceleration while keeping board area and BOM complexity under control.

This device is appropriate for commercial embedded systems, communications modules and interface logic where a combination of moderate logic capacity, flexible I/O and family-level high-speed features are required. The ECP3 family datasheet-backed architecture provides predictable scalability and integration for evolving designs.

Request a quote or submit a sales inquiry to obtain pricing, availability and additional product support information for LFE3-35EA-6LFTN256C.

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